Datasheet > TC358870XBG

TC358870XBG

更新时间： 2024-11-21 20:11:15

品牌	Logo	应用领域
东芝 - TOSHIBA		商用集成电路
页数	文件大小	规格书
22页	905K
描述
Mobile Peripheral Bridge Chip IC

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

TC358870XBG 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
包装说明：	VFBGA,	Reach Compliance Code：	unknown
风险等级：	5.79	商用集成电路类型：	CONSUMER CIRCUIT
JESD-30 代码：	S-PBGA-B80	长度：	7 mm
功能数量：	1	端子数量：	80
最高工作温度：	70 °C	最低工作温度：	-30 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	VFBGA
封装形状：	SQUARE	封装形式：	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：	NOT SPECIFIED	座面最大高度：	1 mm
最大供电电压 (Vsup)：	1.2 V	最小供电电压 (Vsup)：	1.1 V
表面贴装：	YES	技术：	CMOS
温度等级：	OTHER	端子形式：	BALL
端子节距：	0.65 mm	端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	7 mm
Base Number Matches：	1

TC358870XBG 数据手册

TC358870XBG

CMOS Digital Integrated Circuit Silicon Monolithic

TC358870XBG

Overview

Mobile Peripheral Devices

TC358870XBG, Ultra HD to DSI, bridge converts high resolution (higher

than 4 Gbps) HDMI® stream to MIPI® DSI Tx video. It is a follow up device

of TC358779XBG, without scalar functionality. The HDMI-RX runs at 297

MHz to carry up to 7.2 Gbps video stream. It requires dual link MIPI DSI Tx,

1 Gbps/data lane, to transmit out a maximum 7.2 Gbps video data.

P-VFBGA80-0707-0.65-001

Weight: 67 mg (Typ.)

The bridge chip is necessary for current and next generation Application Processors to drive a (dual) DSI link

display by using its HDMI Tx output port.

Features

2048-pixel plus up to full length overlap, DSI0

data length could be different from that of DSI1's

- The maximum Hsync skew between DSI0 and

DSI1 can be less than 10 ByteClk

● HDMI-RX Interface

 HDMI 1.4b

- Video Formats Support (Up to 4K×2K / 30fps),

maximum 24 bps (bit-per-pixel) no deep color

support

 RGB, YCbCr444: 24-bpp

 YCbCr422: 24-bpp

- Color Conversion

 4:2:2 to 4:4:4 is supported

 4:4:4: to 4:2:2 is supported

 Single link DSI, maximum horizontal pixel width

- 2558 pixels (24-bit per pixel)

- 3411 pixels (16-bit per pixel)

 Supports video data formats

- RGB666, RGB888, YCbCr444, YCbCr 422

16-bit and YCbCr 422 24-bit

- YCbCr inputs can be converted into RGB before

outputting

 RGB888 to YCbCr (4:4:4 / 4:2:2) is supported

 YCbCr (4:4:4 / 4:2:2) to RGB888/666 is

supported

● I²C Interface

 Note: for RGB666 (R=R[5:0],2'b00,

G=G[5:0],2'b00, B=G[5:0],2'b00)

- Maximum HDMI clock speed: 297 MHz

- Audio Supports

 Internal Audio PLL to track N/CTS value

transmitted by the ACR packet.

- 3D Support

- Support HDCP1.4 decryptions

- EDID Support, Release A, Revision 1 (Feb 9,

2000)

 Support for normal (100 kHz), fast mode (400 kHz)

and ultrafast mode (2 MHz)

 Slave Mode

- To be used by an external Master to configure all

TC358870XBG internal registers, including

EDID_SRAM and panel control

- Support 2 I²C Slave Addresses (0x0F & 0x1F)

selected through boot-strap pin (INT)

 First 128 byte (EDID 1.3 structure)

 First E-EDID Extension: 128 bytes of CEA

Extension version 3 (specified in CEA-861-D)

 Embedded 1K-byte SRAM (EDID_SRAM)

 Does not support Audio Return Path and HDMI

Ethernet Channels

● Audio Output Interface

 Up to four I2S data lines for supporting

multi-Channel audio data (5.1 and 7.1)

 Maximum audio sample frequency supported is 192

kHz @8 CH

 Support 16, 18, 20 or 24-bit data (depend on HDMI

input stream)

● DSI TX Interface

 Support Master Clock output only

 Support 32 bit-wide time-slot only

 Output Audio Over Sampling clock (256fs)

 Either I2S or TDM Audio interface available (pins

are multiplexed)

 MIPI DSI compliant (Version 1.1 22 November

2011)

 Dual links DSI (DSI0 and DSI1), each link supports

4 data lanes @1 Gbps/ data lane

- DSI0 carries the left half data of HDMI Rx video

stream and DSI1 carries the right one at the

default configuration.

- Left or right data can be assigned/programmed to

either DSI Tx link

 I2S Audio Interface

- Support Left or Right-justify with MSB first

 TDM (Time Division Multiplexed) Audio Interface

- Fixed to 8 channels (depend on HDMI input

stream)

- The maximum length of each half is limited to

2016-04-01

12 3 4 5 6 7...22

中文翻译

下载PDF

与TC358870XBG相关器件

型号	品牌	获取价格	描述	数据表
TC35894FG	TOSHIBA	获取价格	I/O port expansion
TC35894XBG	TOSHIBA	获取价格	I/O port expansion
TC35C25	TELCOM	获取价格	BICMOS PWM CONTROLLERS
TC35C25COE	TELCOM	获取价格	BICMOS PWM CONTROLLERS
TC35C25CPE	TELCOM	获取价格	BICMOS PWM CONTROLLERS
TC35I	INFINEON	获取价格	tc35i
TC3-5S123.3	TRUMPOWER	获取价格	DC/DC CONVERTERS
TC3-5S243.3	TRUMPOWER	获取价格	DC/DC CONVERTERS
TC3-5S483.3	TRUMPOWER	获取价格	DC/DC CONVERTERS
TC-36.000MBD-T	ETC	获取价格	OSC MEMS 36.000MHZ CMOS SMD

与TC358870XBG相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

27
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

19
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

49
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

47

产品中心

服务支持

精选活动

关于我们

帮助中心

TC358870XBG

TC358870XBG 技术参数

TC358870XBG 数据手册

与TC358870XBG相关器件

与TC358870XBG相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

TC358870XBG

TC358870XBG 技术参数

TC358870XBG 数据手册

与TC358870XBG相关器件

与TC358870XBG相关文章

您还可以找

您在本页遇到什么问题？