是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | VFBGA, | Reach Compliance Code: | unknown |
Factory Lead Time: | 16 weeks | 风险等级: | 5.68 |
商用集成电路类型: | CONSUMER CIRCUIT | JESD-30 代码: | S-PBGA-B72 |
长度: | 5 mm | 功能数量: | 1 |
端子数量: | 72 | 最高工作温度: | 85 °C |
最低工作温度: | -30 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
座面最大高度: | 1 mm | 最大供电电压 (Vsup): | 1.3 V |
最小供电电压 (Vsup): | 1.1 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.4 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 5 mm | Base Number Matches: | 1 |
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