TAS5611A
www.ti.com
SLAS709 –JUNE 2010
125W STEREO/250W MONO PurePath™ HD ANALOG-INPUT POWER STAGE
Check for Samples: TAS5611A
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FEATURES
APPLICATIONS
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Home Theater Systems
AV Receivers
DVD/Blu-ray Receivers
Mini Combo System
Active Speakers and Subwoofers
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PurePath™ HD Enabled Integrated Feedback
Provides:
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Signal Bandwidth up to 80kHz for High
Frequency Content From HD Sources
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Ultralow 0.03% THD at 1W into 4Ω
Flat THD at all Frequencies for Natural
Sound
DESCRIPTION
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80dB PSRR (BTL, No Input Signal)
>100dB (A weighted) SNR
The TAS5611A is a high performance analog input
Class
D amplifier with integrated closed loop
feedback technology (known as PurePath™ HD) with
Click and Pop Free Startup
(1)
the ability to drive up to 125W Stereo into 4 to 8 Ω
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Pin compatible with TAS5630, TAS5615 and
TAS5613
Speakers from a single 32.5V supply.
PurePath™ HD technology enables traditional
AB-Amplifier performance (<0.03% THD) levels while
providing the power efficiency of traditional class D
amplifiers.
Multiple Configurations Possible on the Same
PCB With Stuffing Options:
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Mono Parallel Bridge Tied Load (PBTL)
Stereo Bridge Tied Load (BTL)
Unlike traditional Class D amplifiers, the distortion
curve only increases once the output levels move into
clipping. PurePath™ HD Power PAD™
2.1 Single Ended Stereo Pair and Bridge
Tied Load Subwoofer
PurePath™ HD technology enables lower idle losses
making the device even more efficient.
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Total Output Power at 10%THD+N
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250W in Mono PBTL Configuration into 2Ω
TOTAL HARMONIC DISTORTION+NOISE
VS
OUTPUT POWER
125W per Channel in Stereo BTL
Configuration into 4Ω
10
4Ohm (6kHz)
4Ohm (1kHz)
Total Output Power in BTL configuration at
1%THD+N
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130W Stereo into 3Ω
105W Stereo into 4Ω
70W Stereo into 6Ω
55W Stereo into 8Ω
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>90% Efficient Power Stage With 60-mΩ
Output MOSFETs
0,01
TC = 75 C
CONFIG = BTL
Self-Protection Design (Including
Undervoltage, Overtemperature, Clipping, and
Short-Circuit Protection) With Error Reporting
0,001
0,01
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100
PO - Output Power - W
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EMI Compliant When Used With
Recommended System Design
Two Thermally Enhanced Package Options:
(1) Achievable output power levels are dependent on the thermal
configuration of the target application. A high performance
thermal interface material between the package exposed
heatslug and the heat sink should be used to achieve high
output power levels.
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PHD (64-Pin QFP)
DKD (44-Pin PSOP3)
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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PurePath, Power PAD are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated