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T835-600 PDF预览

T835-600

更新时间: 2024-11-25 22:17:31
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 三端双向交流开关
页数 文件大小 规格书
5页 104K
描述
HIGH PERFORMANCE TRIAC

T835-600 数据手册

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T835-600G  
T850-600G  
®
HIGH PERFORMANCE TRIAC  
FEATURES  
A2  
HIGH COMMUTATION PREFORMANCES  
SNUBBERLESSTM TECHNOLOGY  
HIGH NOISE IMMUNITY (dV/dt)  
HIGH ITSM  
G
A2  
A1  
DESCRIPTION  
The T835-600G and T850-600G triacs are using  
high performance SNUBBERLESS technology.  
They are intended for AC control applications  
using surface mount tecnology.  
D2PAK  
These devices are perfectly suited where high  
commutation and surge performances are  
required.  
ABSOLUTE RATINGS  
Symbol  
(limiting values)  
Parameter  
Value  
Unit  
VDRM  
VRRM  
Repetitive peak off-state voltage  
Tj = 125°C  
Tc= 110°C  
600  
V
IT(RMS)  
RMS on-state current  
8
A
A
°
(360 conduction angle)  
Non repetitive surge peak on-state current  
(Tj initial = 25°C)  
ITSM  
tp = 8.3ms  
tp = 10 ms  
tp = 10 ms  
85  
80  
32  
20  
I2t  
A2s  
I2t Value for fusing  
µ
A/ s  
dI/dt  
Critical rate of rise of on-state current  
Repetitive  
F = 50 Hz  
µ
dIG /dt = 1 A/ s.  
IG = 500 mA  
Non Repetitive  
100  
°
°
Tstg  
Tj  
Storage temperature range  
- 40, + 150  
- 40, + 125  
C
Operating junction temperature range  
T
Maximum temperature for soldering during 10s  
260  
C
May 1998 - Ed: 3A  
1/5  

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