Datasheet > T1211LC

T1211LC

更新时间： 2024-12-01 01:25:39

品牌	Logo	应用领域
竹懋 - CITC		/
页数	文件大小	规格书
4页	499K
描述
ESD Protection Device

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中文翻译

获取价格

数据手册

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T1211LC 数据手册

TC1211LC

ESD Protection Device

Chip Integration Technology Corporation

■Features

■Outline

• Uni-directional ESD protection.

• Surface mount package.

• Ultra small SMD package:0402.

• High component density.

SOD-923F

0.041(1.05)

0.037(0.95)

0.026(0.65)

0.022(0.55)

■ Mechanical data

• Case : 0402/SOD-923F standard package,molded plastic.

• Terminals : Gold plated, solderable per MIL-STD-750

Method 2026

• Μarking Code : Cathode band & E2

0.022(0.55)

0.018(0.45)

0.014(0.35)

0.010(0.25)

• Mounting position : Any.

• Weight : 0.001 grams(Approx).

■ Circuit Diagram

0.020(0.50)

0.016(0.40)

Dimensions in inches and (millimeters)

■Maximum ratings and electrical characteristics

(at TA=25°C unless otherwise noted)

Symbol

Typ

Parameter

Conditions

Min

Max

Unit

Marking code

Forward voltage

0.8

15.5

0.1

IF = 10mA

VBD

Diode breakdown voltage

Leakage current

IR = 1mA

13.3

17.5

1.0

VR = 12V

Junction capacitance

VR =0V,f =1MHz

IEC 61000-4-2(air)

IEC 61000-4-2(contact)

IPP = 1 A, tp=8/20us

IPP = 5 A, tp=8/20us

ESD

ESD capability

Clamping Voltage

Peak pulse power

PPP

120

°C

Operating Junction temperature

Storage temperature

-55

+125

+150

TSTG

Document ID : DS-22V13

Revised Date : 2017/02/13

Revision : C

12 3 4

中文翻译

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