F-219 SUPPLEMENT
SC–8P1–GT
SC–1P4–GG
SC, T SERIES
MACHINED TERMINALS & SOCKETS
SPECIFICATIONS
SC–1P1–, SC–6P1–
SC–8P1
SC
Contact: BeCu
Shell: Brass
-GG Plating:
30 µ" (0.76 µm) Au over
50 µ" (1.27 µm) Ni on contact;
10 µ" (0.25 µm) Au over
50 µ" (1.27 µm) Ni on shell
-GT Plating:
(0.76)
.030
(1.83)
.072
DIA
(1.83)
.072
DIA
(2.11)
.083
(1.52)
.061
DIA
30 µ" (0.76 µm) Au over
50 µ" (1.27 µm) Ni on contact;
Sn over 50 µ" (1.27 µm) Ni
on shell
(0.25)
.010
(4.19)
.165
(0.71)
.028
(1.32)
.052
DIA
X
Y
Z
Part No.
DIA
.ꢀ1ꢀ .ꢀ1ꢁ
-TT Plating:
(0.51) (3.18) (7.62)
.020 .125 .300
Sn over 50 µ" (1.27 µm)
Ni on contact; Sn over
50 µ" (1.27 µm) Ni on shell
-ST Plating:
SC–1P1–
SC–6P1–
(1.32)
.052
DIA
(0.74)
Z
.029 DIA
(0.51) (4.57) (8.89)
.020 .180 .350
Y
10 µ" (0.25 µm) Au over
50 µ" (1.27 µm) Ni on contact;
Sn over 50 µ" (1.27 µm)
Ni on shell
X
DIA
Lead DIA Accepted:
(0.38 mm) .015" to
(0.56 mm) .022" and
most IC leads
Insertion Depth (SC-1P1, SC-6P1) = (2.41 mm) .95" to (3.68 mm) .145"
Plating Available (SC-1P1) = GG, GT, TT, ST
Plating Available (SC-6P1) = GG, GT
Insertion Depth = (2.16 mm) .085" to .140" (3.56 mm)
Lead DIA Accepted: (0.41 mm) .016" to (0.51 mm) .020"
Plating Available = GG, GT, TT
SPECIFICATIONS
SC-1P4
Contact: BeCu
Shell: Brass
SC–1P4–
T–1S6–
-GG Plating:
20 µ" (0.51 µm) Au over
50 µ" (1.27 µm) Ni on contact
-GT Plating:
20 µ" (0.51 µm) Au over
50 µ" (1.27 µm) Ni on contact
Insertion Force:
6.5 oz (1.81 N) avg,
13 oz (3.62 N) max
(.032" (0.81 mm) DIA probe)
Withdrawal Force:
3 oz (0.83 N) avg,
2 oz (0.56 N) min
(.032" (0.81 mm) DIA probe)
PART NO.
B
(10.92) .430
(13.46) .530
(18.54) .730
(21.08) .830
(23.62) .930
(26.16) 1.030
(31.24) 1.230
(36.32) 1.430
(16.00) .630
(11.30) .445
(12.19) .480
(7.62) .300
T–1S6–ꢀ7–X–2
T–1S6–ꢀ8–X–2
T–1S6–ꢀ9–X–2
T–1S6–1ꢀ–X–2
T–1S6–11–X–2
T–1S6–12–X–2
T–1S6–13–X–2
T–1S6–14–X–2
T–1S6–1ꢁ–X–2
T–1S6–16–X–2
T–1S6–17–X–2
T–1S6–18–X–2
T–1S6–19–X–2
T–1S6–2ꢀ–X–2
T–1S6–21–X–2
(2.28)
.090
DIA
(0.64)
.025
SQ
(0.76)
.030
SPECIFICATIONS
(0.71)
.028
T-1S6
(2.18)
.086
DIA
RECOMMENDED
PC HOLE SIZE:
LEAD SIZE
T Series is available with
a choice of Gold or Tin
plating. Add -G or -T as
a suffix to the part
number shown.
B
HOLE SIZE
(9.53)
.375
(0.46) .018 DIA
(0.51) .020 DIA
(0.64) .025 DIA
(0.76) .030 DIA
(0.89) .035 DIA
(1.14) .045 DIA
(1.32) .052 DIA
(0.61) .024 DIA
(0.66) .026 DIA
(0.79) .031 DIA
(0.91) .036 DIA
(1.04) .041 DIA
(1.30) .051 DIA
(1.47) .058 DIA
(1.98)
.078
DIA
-G Plating:
Au over 50 µ"
(1.27 µm) Ni
-T Plating:
Sn over 50 µ" (1.27 µm)
Ni or 100 µ" (2.54 µm) Cu
(3.18)
.125
(33.78) 1.330
(28.70) 1.130
(8.51) .335
(0.76)
.030
DIA
(0.46) .018 SQ
(0.64) .025 SQ
(1.14) .045 SQ
(0.76) .030 DIA
(1.02) .040 DIA
(1.75) .069 DIA
(0.20) .008 x (0.71) .028
(0.25) .010 x (0.51) .020
(0.41) .016 x (0.51) .020
(0.41) .016 x (0.61) .024
(0.41) .016 x (0.79) .031
(0.89) .035 DIA
(0.71) .028 DIA
(0.79) .031 DIA
(0.89) .035 DIA
(1.04) .041 DIA
Pins are supplied on a bandolier.
Material: Phosphor Bronze
X = Plating option (specify G or T)
Note:
–G = 10 µ" (0.25 µm) Gold on (4.19 mm) .165"
contact area. Gold flash on balance
Insertion Depth = (4.45 mm ) .175" to (5.46 mm) .215"
Lead DIA Accepted = (0.81 mm) .032" to (0.97 mm) .038"
Plating Available = GG, GT
Some sizes, styles and
options are non-standard,
non-returnable.
–T = 200 µ" (5.08 µm) Tin
Due to technical progress, all designs, specifications and components are subject to change without notice.
WWW.SAMTEC.COM
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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