1SMB5.0AT3G Series,
SZ1SMB5.0AT3G Series
600 Watt Peak Power Zener
Transient Voltage
Suppressors
http://onsemi.com
Unidirectional
PLASTIC SURFACE MOUNT
ZENER OVERVOLTAGE
TRANSIENT SUPPRESSORS
5.0 V − 170 V,
The SMB series is designed to protect voltage sensitive
components from high voltage, high energy transients. They have
excellent clamping capability, high surge capability, low zener
impedance and fast response time. The SMB series is supplied in
ON Semiconductor’s exclusive, cost-effective, highly reliable
600 W PEAK POWER
SURMETIC package and is ideally suited for use in
communication systems, automotive, numerical controls, process
controls, medical equipment, business machines, power supplies and
many other industrial/consumer applications.
SMB
CASE 403A
PLASTIC
Features
Working Peak Reverse Voltage Range − 5.0 V to 170 V
Standard Zener Breakdown Voltage Range − 6.7 V to 199 V
Peak Power − 600 W @ 1.0 ms
Cathode
Anode
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Maximum Clamp Voltage @ Peak Pulse Current
Low Leakage < 5.0 mA Above 10 V
MARKING DIAGRAM
UL 497B for Isolated Loop Circuit Protection
Response Time is Typically < 1.0 ns
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
AYWW
xx G
G
A
Y
= Assembly Location
= Year
WW = Work Week
Pb−Free Packages are Available*
xx
G
= Device Code (Refer to page 3)
= Pb−Free Package
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
FINISH: All external surfaces are corrosion resistant and leads are
readily solderable
(Note: Microdot may be in either location)
ORDERING INFORMATION
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
†
Device
Package
Shipping
260C for 10 Seconds
LEADS: Modified L−Bend providing more contact area to bond pads
POLARITY: Cathode indicated by polarity band
MOUNTING POSITION: Any
1SMBxxxAT3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
SZ1SMBxxxAT3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
February, 2012 − Rev. 13
1SMB5.0AT3/D