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Synchronous Burst

更新时间: 2023-12-06 20:11:25
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25页 433K
描述
TQFP Package

Synchronous Burst 数据手册

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GS8128018/36RT-333M/250M  
GS864018/36RT-333M/250M  
GS832018/36RT-333M/250M  
333 MHz250 MHz  
Rad-Tolerant SRAM  
144Mb/72Mb/36Mb PL/FT Synchronous Burst SRAMs  
100-Pin TQFP  
Military Temp  
2.5 V or 3.3 V V  
DD  
2.5 V or 3.3 V I/O  
positive-edge-triggered clock input (CK). Output enable (G)  
and power down control (ZZ) are asynchronous inputs. Burst  
cycles can be initiated with either ADSP or ADSC inputs. In  
Burst mode, subsequent burst addresses are generated  
internally and are controlled by ADV. The burst address  
counter may be configured to count in either linear or  
interleave order with the Linear Burst Order (LBO) input. The  
Burst function need not be used. New addresses can be loaded  
on every cycle with no degradation of chip performance.  
Features  
• Aerospace-Level Product  
• FT pin for user-configurable flow through or pipeline  
operation  
• Single Cycle Deselect (SCD) operation  
• 2.5 V or 3.3 V +10%/10% core power supply  
• 2.5 V or 3.3 V I/O supply  
• LBO pin for Linear or Interleaved Burst mode  
• Internal input resistors on mode pins allow floating mode pins  
• Default to Interleaved Pipeline mode  
• Byte Write (BW) and/or Global Write (GW) operation  
• Internal self-timed write cycle  
Flow Through/Pipeline Reads  
The function of the Data Output register can be controlled by  
the user via the FT mode pin (Pin 14). Holding the FT mode  
pin low places the RAM in Flow Through mode, causing  
output data to bypass the Data Output Register. Holding FT  
high places the RAM in Pipeline mode, activating the rising-  
edge-triggered Data Output Register.  
• Automatic power-down for portable applications  
• 100-pin TQFP package  
Radiation Performance  
• Total Ionizing Dose (TID) > 50krads(Si)  
• Destructive Single Event Latchup Immunity >37 MeV.cm2/mg  
(100C)  
Byte Write and Global Write  
Byte write operation is performed by using Byte Write enable  
(BW) input combined with one or more individual byte write  
signals (Bx). In addition, Global Write (GW) is available for  
writing all bytes at one time, regardless of the Byte Write  
control inputs.  
Functional Description  
Applications  
Sleep Mode  
The GS8128018/36RT, GS864018/36RT, and  
GS832018/36RT are high performance synchronous SRAMs  
with a 2-bit burst address counter. Although of a type  
originally developed for Level 2 Cache applications supporting  
high performance CPUs, these devices now find application in  
synchronous SRAM applications, ranging from DSP main  
store to networking chip set support.  
Low power (Sleep mode) is attained through the assertion  
(High) of the ZZ signal, or by stopping the clock (CK).  
Memory data is retained during Sleep mode.  
Core and Interface Voltages  
The GS8128018/36RT, GS864018/36RT, and  
GS832018/36RT operate on a 2.5 V or 3.3 V power supply. All  
inputs are 3.3 V and 2.5 V compatible. Separate output power  
Controls  
(V  
) pins are used to decouple output noise from the  
Addresses, data I/Os, chip enables (E1 and E3), address burst  
control inputs (ADSP, ADSC, ADV), and write control inputs  
(Bx, BW, GW) are synchronous and are controlled by a  
DDQ  
internal circuits and are 3.3 V and 2.5 V compatible.  
Parameter Synopsis  
-333M -250M  
Unit  
tKQ  
2.5  
3.0  
2.5  
4.0  
ns  
ns  
tCycle  
Pipeline  
3-1-1-1  
Curr (x18)  
Curr (x36)  
530  
600  
430  
470  
mA  
mA  
tKQ  
tCycle  
4.5  
4.5  
5.5  
5.5  
ns  
ns  
Flow Through  
2-1-1-1  
Curr (x18)  
Curr (x36)  
400  
435  
360  
380  
mA  
mA  
Rev: 1.01a 10/2020  
1/25  
© 2018, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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