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SUM60UFSMSTX PDF预览

SUM60UFSMSTX

更新时间: 2024-11-29 19:10:51
品牌 Logo 应用领域
SSDI 二极管
页数 文件大小 规格书
2页 115K
描述
Rectifier Diode, 1 Element, 0.4A, Silicon, HERMETIC SEALED PACKAGE-2

SUM60UFSMSTX 技术参数

生命周期:Active包装说明:E-LELF-R2
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.70
风险等级:5.66其他特性:METALLURGICALLY BONDED
外壳连接:ISOLATED配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
JESD-30 代码:E-LELF-R2元件数量:1
端子数量:2最高工作温度:175 °C
最低工作温度:-65 °C最大输出电流:0.4 A
封装主体材料:GLASS封装形状:ELLIPTICAL
封装形式:LONG FORM认证状态:Not Qualified
最大反向恢复时间:0.07 µs表面贴装:YES
端子形式:WRAP AROUND端子位置:END
Base Number Matches:1

SUM60UFSMSTX 数据手册

 浏览型号SUM60UFSMSTX的Datasheet PDF文件第2页 
SUM60UF thru SUM100UF  
and  
SUM60UFSMS thru SUM100UFSMS  
Solid State Devices, Inc.  
14701 Firestone Blvd * La Mirada, Ca 90638  
Phone: (562) 404-4474 * Fax: (562) 404-1773  
ssdi@ssdi-power.com * www.ssdi-power.com  
Designer’s Data Sheet  
Part Number/Ordering Information 1/  
500 mA  
ULTRA FAST RECOVERY RECTIFIER  
6,000 thru 10,000 VOLTS  
70 nsec  
SUM __ __ __  
Screening 2/  
__ = Not Screened  
TX = TX Level  
TXV = TXV Level  
S = S Level  
FEATURES:  
PIV to 10,000 Volts  
Package Type  
__ = Axial Leaded  
SMS = Surface Mount Square Tab  
Hermetically sealed axial and square tab surface  
mount package  
Ultra fast recovery 70 nsec maximum 4/  
Void free construction  
Voltage/Family  
60UF = 6,000V  
70UF = 7,000V  
80UF = 8,000V  
90UF = 9,000V  
100UF = 10,000V  
Metallurgically bonded  
175°C maximum operating temperature  
TX, TXV, and S-level screening available2/  
Also available in fast versions, consult factory  
6/  
MAXIMUM RATINGS 3/  
RATING  
SYMBOL VALUE  
UNIT  
SUM60UF and SUM60UFSMS  
SUM70UF and SUM70UFSMS  
SUM80UF and SUM80UFSMS  
SUM90UF and SUM90UFSMS  
SUM100UF and SUM100UFSMS  
6000  
7000  
8000  
9000  
Peak Inverse Voltage  
PIV  
Volts  
10000  
Axial @ L = 3/8”  
TL 75°C  
TL 115°C  
Surface Mount  
TEC 125°C  
Average Rectified Current  
Surge Current (1 Cycle)  
IO1  
IO2  
500  
250  
mA  
T
EC 140°C  
IFSM  
30  
Amps  
°C  
Operating & Storage Temperature 5/  
Typical Thermal Impedance  
TJ and TSTG  
-65 to +175  
Junction to Lead for Axial, L =.375"  
Junction to End Tab for Surface Mount  
RθJL  
RθJE  
15  
5
°C/W  
NOTES:  
1/ For ordering information, price, operating curves, and availability- contact factory.  
2/ Screening based on MIL-PRF-19500. Screening flows available on request.  
3/ Unless otherwise specified, all electrical characteristics @25ºC.  
SMS  
Axial Leaded  
4/ IF = 500mA, IR = 1A, IRR = 250mA, TA = 25°C  
5/ Maximum lead/end temperature for soldering is 250°C, 3/8” from the case for 5 sec. maximum.  
6/ Operating and testing over 10,000 V/inch may require encapsulation or immersion in suitable  
dielectric material.  
NOTE: All specifications are subject to change without notification.  
SCD's for these devices should be reviewed by SSDI prior to release.  
DATA SHEET #: RC0039F  
DOC  

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