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STW8009BS3R/LF PDF预览

STW8009BS3R/LF

更新时间: 2024-11-24 02:59:59
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 消费电路商用集成电路
页数 文件大小 规格书
66页 735K
描述
Mobile video DENC

STW8009BS3R/LF 技术参数

生命周期:Transferred零件包装代码:BGA
包装说明:VFBGA,针数:49
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.29Is Samacsys:N
其他特性:ALSO IT REQUIRES 1.08V TO 1.47V DIGITAL SUPPLY商用集成电路类型:CONSUMER CIRCUIT
JESD-30 代码:S-PBGA-B49长度:3 mm
功能数量:1端子数量:49
最高工作温度:85 °C最低工作温度:-30 °C
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装形状:SQUARE封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
认证状态:Not Qualified座面最大高度:1 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
表面贴装:YES温度等级:COMMERCIAL EXTENDED
端子形式:BALL端子节距:0.4 mm
端子位置:BOTTOM宽度:3 mm
Base Number Matches:1

STW8009BS3R/LF 数据手册

 浏览型号STW8009BS3R/LF的Datasheet PDF文件第2页浏览型号STW8009BS3R/LF的Datasheet PDF文件第3页浏览型号STW8009BS3R/LF的Datasheet PDF文件第4页浏览型号STW8009BS3R/LF的Datasheet PDF文件第5页浏览型号STW8009BS3R/LF的Datasheet PDF文件第6页浏览型号STW8009BS3R/LF的Datasheet PDF文件第7页 
34.80 7IRELESS  
IMPORTANT NOTICE  
Dear customer,  
nd  
As from August 2 2008, the wireless operations of STMicroelectronics have moved to a  
new company, ST-NXP Wireless.  
As a result, the following changes are applicable to the attached document.  
Company name - STMicroelectronics NV is replaced with ST-NXP Wireless.  
Copyright - the copyright notice at the bottom of the last page “© STMicroelectronics  
200x - All rights reserved”, shall now read: “© ST-NXP Wireless 200x - All rights  
reserved”.  
Web site - http://www.st.com is replaced with http://www.stnwireless.com  
Contact information - the list of sales offices is found at http://www.stnwireless.com  
under Contacts.  
If you have any questions related to the document, please contact our nearest sales office.  
Thank you for your cooperation and understanding.  
ST-NXP Wireless  
34.80 7IRELESS  
www.stnwireless.com  

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