是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | 6 X 6 MM, 1.20 MM HEIGHT, ROHS COMPLIANT, TFBGA-84 | 针数: | 84 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.84 | Is Samacsys: | N |
其他特性: | IT ALSO REQUIRES 2.8V SUPPLY | 商用集成电路类型: | CONSUMER CIRCUIT |
JESD-30 代码: | S-PBGA-B84 | JESD-609代码: | e1 |
功能数量: | 1 | 端子数量: | 84 |
最高工作温度: | 70 °C | 最低工作温度: | -25 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
最大供电电压 (Vsup): | 1.9 V | 最小供电电压 (Vsup): | 1.7 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | Base Number Matches: | 1 |
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