是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | 6 X 6 MM, 1.20 MM HEIGHT, LEAD FREE, TFBGA-56 | 针数: | 56 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.83 | Is Samacsys: | N |
商用集成电路类型: | CONSUMER CIRCUIT | JESD-30 代码: | S-PBGA-B56 |
JESD-609代码: | e0 | 长度: | 6 mm |
功能数量: | 1 | 端子数量: | 56 |
最高工作温度: | 70 °C | 最低工作温度: | -25 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装等效代码: | BGA56,10X10,20 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 1.8 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 子类别: | Other Consumer ICs |
最大供电电压 (Vsup): | 1.9 V | 最小供电电压 (Vsup): | 1.7 V |
表面贴装: | YES | 温度等级: | OTHER |
端子面层: | TIN LEAD | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 6 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
STV0974E | STMICROELECTRONICS |
获取价格 |
Mobile Imaging DSP | |
STV0974E/TR | STMICROELECTRONICS |
获取价格 |
SPECIALTY CONSUMER CIRCUIT, PBGA56, 6 X 6 MM, 1.20 MM HEIGHT, LEAD FREE, TFBGA-56 | |
STV0974ETR | STMICROELECTRONICS |
获取价格 |
Mobile Imaging DSP | |
STV0974TR | STMICROELECTRONICS |
获取价格 |
Mobile Imaging DSP | |
STV0976 | STMICROELECTRONICS |
获取价格 |
1.0 Megapixel SMIA Processor | |
STV0976E | STMICROELECTRONICS |
获取价格 |
1.0 Megapixel SMIA Processor | |
STV0976TR | STMICROELECTRONICS |
获取价格 |
1.0 Megapixel SMIA Processor | |
STV0984 | STMICROELECTRONICS |
获取价格 |
2 Megapixel SMIA profile 2 mobile imaging processor | |
STV0984/TR | STMICROELECTRONICS |
获取价格 |
2 MegaPixel SMIA Profile 2 Mobile Imaging Processor | |
STV0984_07 | STMICROELECTRONICS |
获取价格 |
2 Megapixel SMIA profile 2 mobile imaging processor |