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STSS-32-TR PDF预览

STSS-32-TR

更新时间： 2024-01-01 02:12:18
品牌 Logo 应用领域
伯恩斯 - BOURNS 开关小键盘开关
页数 文件大小 规格书
2页 212K
描述
SMD 4 mm Sealed Tact Switch

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中文翻译

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STSS-32-TR 技术参数

是否Rohs认证： 符合生命周期：Obsolete
包装说明：ROHS COMPLIANTReach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8536.50.90.40
风险等级：5.83Is Samacsys：N
主体宽度：2.9 mm主体高度：1.5 mm
主体长度或直径：3.9 mm电路配置：1X1
最大触点电流（直流）：0.05 A触点（直流）最大额定R负载：.05A@12VDC
最大触点电压（直流）：12 V电气寿命：100000 Cycle(s)
JESD-609代码：e4安装特点：SURFACE MOUNT-RIGHT ANGLE
开关数量：1最大操作力：2.79 N
最高工作温度：70 °C最低工作温度：-25 °C
包装方法：TAPE AND REEL表面贴装：NO
开关动作：MOMENTARY-TACTILE开关功能：SPST
开关类型：KEYPAD SWITCH端子面层：Silver (Ag)
端接类型：SOLDERBase Number Matches：1

STSS-32-TR 数据手册

 浏览型号STSS-32-TR的Datasheet PDF文件第2页 
Model STSS is currently available,  
although not recommended for new  
designs.  
Features  
■ Available sharp click feel with a positive  
tactile feedback  
■ Ultra-miniature and lightweight structure  
suitable for high density mounting  
■ Economical with high reliability  
■ RoHS compliant*  
■ Insert molding in the contact with special  
treatment prevents flux buildup during  
soldering and permits autodipping  
STSS SMD 4 mm Sealed Tact Switch  
Electrical Characteristics  
How to Order  
Product Dimensions  
Electrical Life  
ꢀ.80 +0.20/-0.30  
(.189 +.008/-.012  
STSS - 32 - TR  
..........................................100,000 cycles  
Rating ..................................DC 12 V 50 mA  
Contact Resistance ......100 milliohms max.  
Insulation Resistance  
Model  
3.90 0.10  
(.15ꢀ .00ꢀ4  
Terminal  
..................100 megohms, DC 100 V min.  
Dielectric Strength....100 V AC for 1 minute  
Contact Arrangement........1 pole 1 position  
Embossed Tape  
TR = 3500 Pcs./180 mm Reel  
3.55  
(1.ꢀ04  
Environmental Characteristics  
2.10  
(.0834  
Operation Force........................220 g ±±5 g  
Stroke  
Circuit Diagram  
................................0.2 + 0.10/- 0.05 mm  
Operating Temperature ....-25 °C to +70 °C  
Storage Temperature ........-30 °C to +80 °C  
1.20  
(.0ꢀ74  
1.70  
(.0674  
1.ꢀ0 0.10  
(.055 .00ꢀ4  
1
2
2.90 0.10  
(.11ꢀ .00ꢀ4  
Vibration Test........................Mil-STD-202F,  
Method 201A  
Frequency ..............10-55-10 Hz/1 minute  
Directions ................X,Y,Z, three mutually  
perpendicular directions  
Reflow Soldering Profile  
1.50 +0.15/-0.10  
(.059 +.006/-.00ꢀ4  
1.00  
(.0394  
275  
225  
2ꢀ0 °C  
180 °C  
Time ......................2 hours each direction  
Shock Test ..........................MIL-STD-202F,  
Method 213B, Condition A  
Gravity ..........50 G (peak value), 11 msec  
Direction & Times....................± sides and  
3 times in each direction  
175  
10-15  
Sec.  
0.65 +0/-0.10  
(.026 +0/-.00ꢀ4  
DIA.  
125  
120 °C  
0.06  
0.50  
80-90 Sec.  
(.0024  
(.0204  
75  
25  
0.10  
(.00ꢀ4  
35-60  
Sec.  
30-ꢀ0 Sec.  
Physical Characteristics  
0
20 ꢀ0 60 80 100 120 1ꢀ0 160 180 200  
0.80 0.10  
(.03 .00ꢀ4  
Time (Seconds)  
Cover Materials  
..........................................Stainless Steel  
Base Materials  
........LCP high temp. thermoplastic, white  
Actuator Materials  
........LCP high temp. thermoplastic, black  
Contact Disc Materials  
....................Stainless with silver cladding  
Terminal Materials  
............................Brass with silver plated  
Tape ..................................................Teflon  
Hand Soldering Process  
..............Use a soldering iron of 30 watts,  
controlled at 320 °C (±08 °F)  
1.80 0.10  
(.071 .00ꢀ4  
Recommended PCB Layout  
ꢀ.60  
(.1814  
3.60  
(.1ꢀ24  
2.60  
(.1024  
for approximately 2 seconds while  
applying solder  
Reflow Soldering Process  
..............When applying reflow soldering,  
the peak temperature or the reflow oven  
should be set to 240 °C  
2.ꢀ0 1.80  
(.09ꢀ4 (.0714  
1.70  
(.0674  
Packaging ..................3,500 pieces per reel  
0.80 +0.10/-0  
(.028 +.00ꢀ/04  
DIA. 2 PLCS.  
3.20  
(.1264  
5.00  
(.1974  
MM  
(INCHES4  
DIMENSIONS ARE:  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
12

中文翻译

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