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STP6NC80ZFP PDF预览

STP6NC80ZFP

更新时间: 2024-01-14 10:52:13
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
13页 512K
描述
N-CHANNEL 800V - 1.5ohm - 5.4A TO-220/FP/DPAK/IPAK Zener-Protected PowerMESH⑩III MOSFET

STP6NC80ZFP 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-220AB包装说明:TO-220FP, 3 PIN
针数:3Reach Compliance Code:compliant
风险等级:5.65雪崩能效等级(Eas):237 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:800 V最大漏极电流 (Abs) (ID):5.4 A
最大漏极电流 (ID):5.4 A最大漏源导通电阻:1.8 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):40 W
最大脉冲漏极电流 (IDM):21 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

STP6NC80ZFP 数据手册

 浏览型号STP6NC80ZFP的Datasheet PDF文件第2页浏览型号STP6NC80ZFP的Datasheet PDF文件第3页浏览型号STP6NC80ZFP的Datasheet PDF文件第4页浏览型号STP6NC80ZFP的Datasheet PDF文件第5页浏览型号STP6NC80ZFP的Datasheet PDF文件第6页浏览型号STP6NC80ZFP的Datasheet PDF文件第7页 
STP6NC80Z - STP6NC80ZFP  
STB6NC80Z - STB6NC80Z-1  
N-CHANNEL 800V - 1.5- 5.4A TO-220/FP/D²PAK/I²PAK  
Zener-Protected PowerMESH™III MOSFET  
TYPE  
V
DSS  
R
I
D
DS(on)  
STP6NC80Z/FP  
STB6NC80Z/-1  
800V  
800V  
< 1.8 Ω  
< 1.8 Ω  
5.4 A  
5.4 A  
3
1
TYPICAL R (on) = 1.5 Ω  
DS  
3
2
D²PAK  
1
EXTREMELY HIGH dv/dt AND CAPABILITY  
GATE-TO- SOURCE ZENER DIODES  
100% AVALANCHE TESTED  
VERY LOW GATE INPUT RESISTANCE  
GATE CHARGE MINIMIZED  
TO-220  
TO-220FP  
3
2
1
I²PAK  
(Tabless TO-220)  
DESCRIPTION  
The third generation of MESH OVERLAY™ Power  
MOSFETs for very high voltage exhibits unsurpassed  
on-resistance per unit area while integrating back-to-  
back Zener diodes between gate and source. Such ar-  
rangement gives extra ESD capability with higher rug-  
gedness performance as requested by a large variety  
of single-switch applications.  
APPLICATIONS  
SINGLE-ENDED SMPS IN MONITORS,  
COMPUTER AND INDUSTRIAL APPLICATION  
WELDING EQUIPMENT  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
STP(B)6NC80Z(-1) STP6NC80ZFP  
V
Drain-source Voltage (V = 0)  
800  
800  
± 25  
V
V
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
DGR  
GS  
V
Gate- source Voltage  
V
GS  
I
Drain Current (continuous) at T = 25°C  
5.4  
3.4  
21  
5.4(*)  
3.4(*)  
21(*)  
40  
A
D
C
I
Drain Current (continuous) at T = 100°C  
A
D
C
I
(1)  
Drain Current (pulsed)  
A
DM  
P
Total Dissipation at T = 25°C  
125  
1
W
TOT  
C
Derating Factor  
0.32  
W/°C  
mA  
KV  
V/ns  
V
I
Gate-source Current ()  
±50  
3
GS  
V
Gate source ESD(HBM-C=100pF, R=15KΩ)  
Peak Diode Recovery voltage slope  
Insulation Winthstand Voltage (DC)  
Storage Temperature  
ESD(G-S)  
dv/dt  
3
V
ISO  
--  
2000  
T
stg  
–65 to 150  
150  
°C  
°C  
T
Max. Operating Junction Temperature  
j
(•)Pulse width limited by safe operating area  
December 2002  
(1)I 5.4A, di/dt 100A/µs, V V  
, T T  
j JMAX  
SD  
DD  
(BR)DSS  
(*)Pulse width Limited by maximum temperature allowed  
1/13  
.

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