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STM32F410R8T6 PDF预览

STM32F410R8T6

更新时间: 2024-09-22 17:33:23
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
142页 1987K
描述
支持BAM的STM32动态效率MCU,带DSP和FPU的高性能ARM Cortex-M4 MCU,具有64 KB Flash、100 MHz CPU和ART加速器

STM32F410R8T6 技术参数

生命周期:Active包装说明:LFQFP,
Reach Compliance Code:compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01Factory Lead Time:14 weeks
风险等级:1.56具有ADC:YES
地址总线宽度:位大小:32
最大时钟频率:26 MHzDAC 通道:YES
DMA 通道:YES外部数据总线宽度:
JESD-30 代码:S-PQFP-G64长度:10 mm
I/O 线路数量:50端子数量:64
片上程序ROM宽度:8最高工作温度:85 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIEDRAM(字节):32768
ROM(单词):65536ROM可编程性:FLASH
座面最大高度:1.6 mm速度:100 MHz
最大供电电压:3.6 V最小供电电压:1.7 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

STM32F410R8T6 数据手册

 浏览型号STM32F410R8T6的Datasheet PDF文件第2页浏览型号STM32F410R8T6的Datasheet PDF文件第3页浏览型号STM32F410R8T6的Datasheet PDF文件第4页浏览型号STM32F410R8T6的Datasheet PDF文件第5页浏览型号STM32F410R8T6的Datasheet PDF文件第6页浏览型号STM32F410R8T6的Datasheet PDF文件第7页 
STM32F410x8 STM32F410xB  
ARM®-Cortex®-M4 32b MCU+FPU, 125 DMIPS, 128KB Flash,  
32KB RAM, 9 TIMs, 1 ADC, 1 DAC, 1 LPTIM, 9 comm. interfaces  
Datasheet - production data  
Features  
&"'!  
Dynamic Efficiency Line with eBAM (enhanced  
Batch Acquisition Mode)  
– 1.7 V to 3.6 V power supply  
– -40 °C to 85/105/125 °C temperature range  
WLCSP36  
(2.553x2.579mm)  
LQFP48 (7x7mm)  
LQFP64 (10×10mm)  
UFQFPN48  
(7×7mm)  
UFBGA64  
5x5mm  
(
)
®
®
Core: ARM 32-bit Cortex -M4 CPU with FPU,  
Adaptive real-time accelerator (ART  
Accelerator™) allowing 0-wait state execution  
from Flash memory, frequency up to 100 MHz,  
memory protection unit,  
– One 16-bit advanced motor-control timer  
– Three 16-bit general purpose timers  
– One 32-bit timer up to 100 MHz with up to  
four IC/OC/PWM or pulse counter and  
quadrature (incremental) encoder input  
– Two watchdog timers (independent  
window)  
– SysTick timer.  
125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1),  
and DSP instructions  
Memories  
– Up to 128 Kbytes of Flash memory  
– 512 bytes of OTP memory  
– 32 Kbytes of SRAM  
Debug mode  
– Serial wire debug (SWD) & JTAG  
interfaces  
Clock, reset and supply management  
– 1.7 V to 3.6 V application supply and I/Os  
– POR, PDR, PVD and BOR  
®
– Cortex -M4 Embedded Trace Macrocell™  
Up to 50 I/O ports with interrupt capability  
– Up to 45 fast I/Os up to 100 MHz  
– Up to 49 5 V-tolerant I/Os  
– 4-to-26 MHz crystal oscillator  
– Internal 16 MHz factory-trimmed RC  
– 32 kHz oscillator for RTC with calibration  
– Internal 32 kHz RC with calibration  
Up to 9 communication interfaces  
2
– Up to 3x I C interfaces (SMBus/PMBus)  
2
including 1x I C Fast-mode at 1 MHz  
Power consumption  
– Run: 89 µA/MHz (peripheral off)  
– Stop (Flash in Stop mode, fast wakeup  
time): 40 µA Typ @ 25 °C; 49 µA max  
@25 °C  
– Up to 3 USARTs (2 x 12.5 Mbit/s,  
1 x 6.25 Mbit/s), ISO 7816 interface, LIN,  
IrDA, modem control)  
– Up to 3 SPI/I2Ss (up to 50 Mbit/s SPI or  
I2S audio protocol)  
– Stop (Flash in Deep power down mode,  
slow wakeup time): down to 6 µA @ 25 °C;  
14 µA max @25 °C  
– Standby: 2.4 µA @25 °C / 1.7 V without  
RTC; 12 µA @85 °C @1.7 V  
True random number generator  
CRC calculation unit  
96-bit unique ID  
RTC: subsecond accuracy, hardware calendar  
– V  
supply for RTC: 1 µA @25 °C  
®
BAT  
All packages are ECOPACK 2  
1×12-bit, 2.4 MSPS ADC: up to 16 channels  
1×12-bit D/A converter  
Table 1. Device summary  
Reference  
Part number  
General-purpose DMA: 16-stream DMA  
controllers with FIFOs and burst support  
STM32F410T8, STM32F410C8,  
STM32F410R8  
STM32F410x8  
Up to 9 timers  
– One low-power timer (available in Stop  
mode)  
STM32F410TB, STM32F410CB,  
STM32F410RB  
STM32F410xB  
April 2017  
DocID028094 Rev 5  
1/142  
This is information on a product in full production.  
www.st.com  
 
 

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