是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | SSOP | 包装说明: | HTSSOP-28 |
针数: | 28 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.84 |
Is Samacsys: | N | JESD-30 代码: | R-PDSO-G28 |
JESD-609代码: | e0 | 长度: | 9.7 mm |
负电源额定电压: | -5 V | 功能数量: | 1 |
端子数量: | 28 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 电信集成电路类型: | TELECOM CIRCUIT |
温度等级: | INDUSTRIAL | 端子面层: | TIN LEAD |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 4.4 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
STLC60454 | STMICROELECTRONICS |
获取价格 |
SPECIALTY TELECOM CIRCUIT, PBGA144, 13 X 13 MM, LBGA-144 | |
STLC60845 | STMICROELECTRONICS |
获取价格 |
SPECIALTY TELECOM CIRCUIT, PBGA292, 27 X 27 MM, PLASTIC, BGA-292 | |
STLC61256 | STMICROELECTRONICS |
获取价格 |
ADSL Central Office (CO) Chipset: STLC61256/55 + STLC60454 + STLC60243 | |
STLC61265 | STMICROELECTRONICS |
获取价格 |
SPECIALTY TELECOM CIRCUIT, PBGA676, 27 X 27 MM, PLASTIC, BGA-676 | |
STLC61266 | STMICROELECTRONICS |
获取价格 |
SPECIALTY TELECOM CIRCUIT, PBGA676, 27 X 27 MM, PLASTIC, BGA-676 | |
STLC7545CFN | ETC |
获取价格 |
MODEM CIRCUIT|ANALOG FRONT END|CMOS|LDCC|44PIN|PLASTIC | |
STLC7545CFNTR | STMICROELECTRONICS |
获取价格 |
38.4kbps DATA, MODEM-SUPPORT CIRCUIT, PQCC44, PLASTIC, LCC-44 | |
STLC7545TQFP4Y | ETC |
获取价格 |
MODEM CIRCUIT|ANALOG FRONT END|CMOS|QFP|44PIN|PLASTIC | |
STLC7545TQFP4YTR | STMICROELECTRONICS |
获取价格 |
38.4kbps DATA, MODEM-SUPPORT CIRCUIT, PQFP44, 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-44 | |
STLC7546CFN | ETC |
获取价格 |
MODEM CIRCUIT|ANALOG FRONT END|CMOS|LDCC|28PIN|PLASTIC |