生命周期: | Not Recommended | 零件包装代码: | D2PAK |
包装说明: | D2PAK-3 | 针数: | 3 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
风险等级: | 5.22 | Is Samacsys: | N |
外壳连接: | COLLECTOR | 最大集电极电流 (IC): | 40 A |
配置: | SINGLE WITH BUILT-IN DIODE AND RESISTOR | 门极发射器阈值电压最大值: | 2 V |
JESD-30 代码: | R-PSSO-G2 | JESD-609代码: | e3 |
元件数量: | 1 | 端子数量: | 2 |
最高工作温度: | 175 °C | 封装主体材料: | PLASTIC/EPOXY |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 245 | 极性/信道类型: | N-CHANNEL |
最大功率耗散 (Abs): | 200 W | 认证状态: | Not Qualified |
子类别: | Insulated Gate BIP Transistors | 表面贴装: | YES |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子位置: | SINGLE | 处于峰值回流温度下的最长时间: | 30 |
晶体管应用: | POWER CONTROL | 晶体管元件材料: | SILICON |
标称断开时间 (toff): | 15000 ns | 标称接通时间 (ton): | 2900 ns |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
STGB20NB37LZ | STMICROELECTRONICS |
类似代替 |
N-CHANNEL CLAMPED 20A D2PAK INTERNALLY CLAMPED PowerMESH IGBT | |
STGB20NB41LZT4 | STMICROELECTRONICS |
类似代替 |
N-CHANNEL CLAMPED 20A - DPAK INTERNALLY CLAMPED PowerMESH IGBT |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
STGB20NB41LZ | STMICROELECTRONICS |
获取价格 |
N-CHANNEL CLAMPED 20A - DPAK INTERNALLY CLAMPED PowerMESH IGBT | |
STGB20NB41LZT4 | STMICROELECTRONICS |
获取价格 |
N-CHANNEL CLAMPED 20A - DPAK INTERNALLY CLAMPED PowerMESH IGBT | |
STGB20NC60V | STMICROELECTRONICS |
获取价格 |
30 A - 600 V - very fast IGBT | |
STGB20NC60VT4 | STMICROELECTRONICS |
获取价格 |
60A, 600V, N-CHANNEL IGBT, TO-263AB, ROHS COMPLIANT, TO-263, D2PAK-3 | |
STGB25N36LZAG | STMICROELECTRONICS |
获取价格 |
Automotive-grade 360 V internally clamped IGBT ESCIS 300 mJ | |
STGB25N40LZAG | STMICROELECTRONICS |
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汽车级400 V内部钳制IGBT ESCIS 320 mJ | |
STGB30H60DFB | STMICROELECTRONICS |
获取价格 |
600 V、30 A高速沟槽栅场截止HB系列IGBT | |
STGB30H60DLLFBAG | STMICROELECTRONICS |
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汽车级600 V、30 A高速沟槽栅场截止HB系列IGBT | |
STGB30H65DFB2 | STMICROELECTRONICS |
获取价格 |
Trench gate field-stop 650 V, 30 A high speed HB2 series IGBT in a D2PAK package | |
STGB30M65DF2 | STMICROELECTRONICS |
获取价格 |
沟槽栅场截止IGBT,M系列,650 V、30 A,低损耗 |