是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | QFN | 包装说明: | VQCCN, LCC16,.07X.1,16 |
针数: | 16 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.83 |
模拟集成电路 - 其他类型: | SPDT | JESD-30 代码: | R-XQCC-N16 |
长度: | 2.6 mm | 信道数量: | 1 |
功能数量: | 4 | 端子数量: | 16 |
标称断态隔离度: | 64 dB | 通态电阻匹配规范: | 0.06 Ω |
最大通态电阻 (Ron): | 0.5 Ω | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 输出: | SEPARATE OUTPUT |
封装主体材料: | UNSPECIFIED | 封装代码: | VQCCN |
封装等效代码: | LCC16,.07X.1,16 | 封装形状: | RECTANGULAR |
封装形式: | CHIP CARRIER, VERY THIN PROFILE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 1.8/3.6 V | 认证状态: | Not Qualified |
座面最大高度: | 1 mm | 子类别: | Multiplexer or Switches |
最大供电电压 (Vsup): | 4.3 V | 最小供电电压 (Vsup): | 1.65 V |
标称供电电压 (Vsup): | 2.7 V | 表面贴装: | YES |
最长断开时间: | 30 ns | 最长接通时间: | 50 ns |
切换: | BREAK-BEFORE-MAKE | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 1.8 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
STG3699B | STMICROELECTRONICS |
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Low Voltage 0.5ohm Max, Quad SPDT Switch with break-before-make feature | |
STG3699B_07 | STMICROELECTRONICS |
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Low voltage 0.5 ヘ max, quad SPDT switch with | |
STG3699BVTR | STMICROELECTRONICS |
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Low Voltage 0.5ohm Max, Quad SPDT Switch with break-before-make feature | |
STG3699QTR | STMICROELECTRONICS |
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LOW VOLTAGE 0.5з MAX QUAD SPDT SWITCH WITH BR | |
STG3699TTR | STMICROELECTRONICS |
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LOW VOLTAGE 0.5з MAX QUAD SPDT SWITCH WITH BR | |
STG3820 | STMICROELECTRONICS |
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Low voltage high bandwidth quad DPDT switch | |
STG3820BJR | STMICROELECTRONICS |
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Low voltage high bandwidth quad DPDT switch | |
STG3856 | STMICROELECTRONICS |
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Low Voltage 1.0? Max Dual SP3T Switch With Break Before Make Feature | |
STG3856QTR | STMICROELECTRONICS |
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Low voltage 1.0Ω max dual SP3T switch with break-before-make feature | |
STG3P2M10N60B | STMICROELECTRONICS |
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1-Phase bridge rectifier + 3 phase inverter IGBT - SEMITOP 2 module |