品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | ![]() |
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页数 | 文件大小 | 规格书 |
17页 | 907K | ![]() |
描述 | ||
N-channel 600 V, 0.57 Ohm, 8 A, DPAK FDmesh(TM) II Power MOSFET |
是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | TO-252 | 包装说明: | SMALL OUTLINE, R-PSSO-G2 |
针数: | 3 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | Factory Lead Time: | 16 weeks |
风险等级: | 0.92 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 222020 |
Samacsys Pin Count: | 3 | Samacsys Part Category: | Transistor |
Samacsys Package Category: | TO-XXX (Inc. DPAK) | Samacsys Footprint Name: | DPAK (TO-252)_2 |
Samacsys Released Date: | 2015-07-28 09:15:31 | Is Samacsys: | N |
雪崩能效等级(Eas): | 130 mJ | 配置: | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压: | 600 V | 最大漏极电流 (Abs) (ID): | 8 A |
最大漏极电流 (ID): | 8 A | 最大漏源导通电阻: | 0.6 Ω |
FET 技术: | METAL-OXIDE SEMICONDUCTOR | JEDEC-95代码: | TO-252 |
JESD-30 代码: | R-PSSO-G2 | JESD-609代码: | e3 |
湿度敏感等级: | 1 | 元件数量: | 1 |
端子数量: | 2 | 工作模式: | ENHANCEMENT MODE |
最高工作温度: | 150 °C | 封装主体材料: | PLASTIC/EPOXY |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 260 | 极性/信道类型: | N-CHANNEL |
最大功率耗散 (Abs): | 70 W | 最大脉冲漏极电流 (IDM): | 32 A |
子类别: | FET General Purpose Power | 表面贴装: | YES |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | GULL WING |
端子位置: | SINGLE | 处于峰值回流温度下的最长时间: | 30 |
晶体管应用: | SWITCHING | 晶体管元件材料: | SILICON |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
STD10NM60N | STMICROELECTRONICS |
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