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STB3NC90 PDF预览

STB3NC90

更新时间: 2024-02-24 19:06:11
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
9页 421K
描述
N-CHANNEL 900V - 3.2W - 3.5A D2PAK Zener-Protected PowerMESH⑩III MOSFET

STB3NC90 数据手册

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STB3NC90Z  
2
N-CHANNEL 900V - 3.2- 3.5A D PAK  
Zener-Protected PowerMESH™III MOSFET  
TYPE  
V
DSS  
R
I
D
DS(on)  
STB3NC90  
900V  
< 3.5Ω  
3.5 A  
TYPICAL R (on) = 3.2Ω  
DS  
EXTREMELY HIGH dv/dt AND CAPABILITY GATE  
TO - SOURCE ZENER DIODES  
3
100% AVALANCHE TESTED  
VERY LOW GATE INPUT RESISTANCE  
GATE CHARGE MINIMIZED  
1
2
D PAK  
DESCRIPTION  
The third generation of MESH OVERLAY™ Power  
MOSFETs for very high voltage exhibits unsurpassed  
on-resistance per unit area while integrating back-to-  
back Zener diodes between gate and source. Such ar-  
rangement gives extra ESD capability with higher rug-  
gedness performance as requested by a large variety  
of single-switch applications.  
APPLICATIONS  
SINGLE-ENDED SMPS IN MONITORS,  
COMPUTER AND INDUSTRIAL APPLICATION  
WELDING EQUIPMENT  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
900  
Unit  
V
V
DS  
Drain-source Voltage (V = 0)  
GS  
V
Drain-gate Voltage (R = 20 k)  
900  
V
DGR  
GS  
V
Gate- source Voltage  
± 25  
3.5  
V
GS  
I
Drain Current (continuos) at T = 25°C  
A
D
C
I
Drain Current (continuos) at T = 100°C  
2.2  
A
D
C
I
()  
Drain Current (pulsed)  
14  
A
DM  
P
TOT  
Total Dissipation at T = 25°C  
100  
W
C
Derating Factor  
0.8  
W/°C  
mA  
KV  
V/ns  
°C  
°C  
I
Gate-source Current (*)  
±50  
GS  
V
Gate source ESD(HBM-C=100pF, R=15KΩ)  
Peak Diode Recovery voltage slope  
Storage Temperature  
2.5  
ESD(G-S)  
dv/dt  
3
T
stg  
–65 to 150  
150  
T
Max. Operating Junction Temperature  
j
(•)Pulse width limited by safe operating area  
(1)I 3.5A, di/dt 100A/µs, V  
V , T T  
(BR)DSS j JMAX  
SD  
DD  
(*) Limited only by maximum temperature allowed  
.
May 2001  
1/9  

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