品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | 存储 | |
页数 | 文件大小 | 规格书 |
172页 | 1468K | |
描述 | ||
8-BIT MCU WITH FLASH OR ROM MEMORY, ADC, TWO 16-BIT TIMERS, I2C, SPI, SCI INTERFACES |
是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | LFBGA, BGA36,6X6,32 | 针数: | 36 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.77 | 具有ADC: | YES |
其他特性: | ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 8 MHZ | 地址总线宽度: | |
位大小: | 8 | CPU系列: | ST72 |
最大时钟频率: | 16 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | |
JESD-30 代码: | S-PBGA-B36 | JESD-609代码: | e1 |
长度: | 6 mm | I/O 线路数量: | 22 |
端子数量: | 36 | 片上程序ROM宽度: | 8 |
最高工作温度: | 70 °C | 最低工作温度: | |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装等效代码: | BGA36,6X6,32 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 3/5 V |
认证状态: | Not Qualified | RAM(字节): | 256 |
ROM(单词): | 8192 | ROM可编程性: | FAST |
座面最大高度: | 1.7 mm | 速度: | 16 MHz |
子类别: | Microcontrollers | 最大压摆率: | 11 mA |
最大供电电压: | 5.5 V | 最小供电电压: | 3.3 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 6 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER | Base Number Matches: | 1 |
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