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SSTV16859DGG PDF预览

SSTV16859DGG

更新时间: 2024-10-01 06:14:23
品牌 Logo 应用领域
恩智浦 - NXP 逻辑集成电路光电二极管驱动双倍数据速率
页数 文件大小 规格书
14页 119K
描述
2.5 V 13-bit to 26-bit SSTL_2 registered buffer for stacked DDR DIMM

SSTV16859DGG 技术参数

生命周期:Obsolete零件包装代码:TSSOP
包装说明:TSSOP, TSSOP64,.32,20针数:64
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.22系列:SSTV
JESD-30 代码:R-PDSO-G64JESD-609代码:e4
长度:17 mm逻辑集成电路类型:D FLIP-FLOP
位数:13功能数量:1
端子数量:64最高工作温度:70 °C
最低工作温度:输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP64,.32,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH电源:2.5,2.5/3.3 V
传播延迟(tpd):2.8 ns认证状态:Not Qualified
座面最大高度:1.2 mm子类别:Other Logic ICs
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:NICKEL PALLADIUM GOLD端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
触发器类型:POSITIVE EDGE宽度:6.1 mm
最小 fmax:200 MHzBase Number Matches:1

SSTV16859DGG 数据手册

 浏览型号SSTV16859DGG的Datasheet PDF文件第2页浏览型号SSTV16859DGG的Datasheet PDF文件第3页浏览型号SSTV16859DGG的Datasheet PDF文件第4页浏览型号SSTV16859DGG的Datasheet PDF文件第5页浏览型号SSTV16859DGG的Datasheet PDF文件第6页浏览型号SSTV16859DGG的Datasheet PDF文件第7页 
INTEGRATED CIRCUITS  
SSTV16859  
2.5 V 13-bit to 26-bit SSTL_2  
registered buffer for stacked DDR DIMM  
Product data  
2002 Feb 19  
2000 Dec 01  
File under Integrated Circuits — ICL03  
Philips  
Semiconductors  

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