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SST26VF032B PDF预览

SST26VF032B

更新时间: 2024-11-27 00:50:03
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美国微芯 - MICROCHIP /
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77页 927K
描述
2.5V/3.0V 32 Mbit Serial Quad I/O (SQI) Flash Memory

SST26VF032B 数据手册

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SST26VF032B / SST26VF032BA  
2.5V/3.0V 32 Mbit Serial Quad I/O (SQI) Flash Memory  
• Security ID  
Features  
- One-Time Programmable (OTP) 2 KByte, Secure ID  
- 64 bit unique, factory pre-programmed identifier  
- User-programmable area  
• Single Voltage Read and Write Operations  
- 2.7-3.6V or 2.3-3.6V  
• Serial Interface Architecture  
Temperature Range  
- Nibble-wide multiplexed I/O’s with SPI-like serial  
command structure  
- Industrial: -40°C to +85°C  
- Extended: -40°C to +105°C  
- Mode 0 and Mode 3  
• Packages Available  
- x1/x2/x4 Serial Peripheral Interface (SPI) Protocol  
• High Speed Clock Frequency  
- 8-contact WDFN (6mm x 5mm)  
- 8-lead SOIJ (5.28 mm)  
- 24-ball TBGA (6mm x 8mm)  
- 2.7-3.6V: 104 MHz max  
- 2.3-3.6V: 80 MHz max  
• All devices are RoHS compliant  
• Burst Modes  
- Continuous linear burst  
- 8/16/32/64 Byte linear burst with wrap-around  
Product Description  
The Serial Quad I/O™ (SQI™) family of flash-memory  
devices features a six-wire, 4-bit I/O interface that allows for  
low-power, high-performance operation in a low pin-count  
package. SST26VF032B/032BA also support full com-  
mand-set compatibility to traditional Serial Peripheral Inter-  
face (SPI) protocol. System designs using SQI flash devices  
occupy less board space and ultimately lower system costs.  
• Superior Reliability  
- Endurance: 100,000 Cycles (min)  
- Greater than 100 years Data Retention  
• Low Power Consumption:  
- Active Read current: 15 mA (typical @ 104 MHz)  
- Standby Current: 15 µA (typical)  
• Fast Erase Time  
All members of the 26 Series, SQI family are manufactured  
with proprietary, high-performance CMOS SuperFlash®  
technology. The split-gate cell design and thick-oxide tun-  
neling injector attain better reliability and manufacturability  
compared with alternate approaches.  
- Sector/Block Erase: 18 ms (typ), 25 ms (max)  
- Chip Erase: 35 ms (typ), 50 ms (max)  
• Page-Program  
- 256 Bytes per page in x1 or x4 mode  
• End-of-Write Detection  
SST26VF032B/032BA significantly improve performance  
and reliability, while lowering power consumption. These  
devices write (Program or Erase) with a single power supply  
of 2.3-3.6V. The total energy consumed is a function of the  
applied voltage, current, and time of application. Since for  
any given voltage range, the SuperFlash technology uses  
less current to program and has a shorter erase time, the  
total energy consumed during any Erase or Program opera-  
tion is less than alternative flash memory technologies.  
- Software polling the BUSY bit in status register  
• Flexible Erase Capability  
- Uniform 4 KByte sectors  
- Four 8 KByte top and bottom parameter overlay  
blocks  
- One 32 KByte top and bottom overlay block  
- Uniform 64 KByte overlay blocks  
• Write-Suspend  
SST26VF032B/032BA are offered in 8-contact WDFN  
(6 mm x 5 mm), 8-lead SOIJ (5.28 mm), and 24-ball  
TBGA(6mm x 8mm). See Figure 2-2 for pin assignments.  
- Suspend Program or Erase operation to access  
another block/sector  
• Software Reset (RST) mode  
• Software Write Protection  
Two configurations are available upon order.  
SST26VF032B default at power-up has the WP# and  
HOLD# pins enabled, and the SIO2 and SIO3 pins dis-  
- Individual-Block Write Protection with permanent  
lock-down capability  
abled,  
to  
initiate  
SPI-protocol  
operations.  
SST26VF032BA default at power-up has the WP# and  
HOLD# pins disabled, and the SIO2 and SIO3 pins  
enabled, to initiate Quad I/O operations. See “I/O Con-  
figuration (IOC)” on page 12 for more information about  
configuring WP#/HOLD# and SIO2/SIO3 pins.  
- 64 KByte blocks, two 32 KByte blocks, and  
eight 8 KByte parameter blocks  
- Read Protection on top and bottom 8 KByte  
parameter blocks  
2013-2016 Microchip Technology Inc.  
DS20005218E-page 1  

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