SSP7440N
15 A, 40 V, RDS(ON) 15 m
N-Channel Enhancement MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
SOP-8PP
DESCRIPTION
B
These miniature surface mount MOSFETs utilize a high cell density trench process
to provide low RDS(on) and to ensure minimal power loss and heat dissipation.
Typical applications are DC-DC converters and power management in
portable and battery-powered products such as computers, printers,
PCMCIA cards, cellular and cordless telephones.
D
C
θ
e
E
FEATURES
Low RDS(on) provides higher efficiency and extends battery life.
Low thermal impedance copper leadframe SOP-8PP saves board
space.
A
b
d
g
Fast switching speed.
High performance trench technology.
F
G
Millimeter
Min. Max.
Millimeter
REF.
REF.
Min.
Max.
PRODUCT SUMMARY
PRODUCT SUMMARY
A
B
C
D
E
F
1.00
5.70
0.20
3.61
5.40
0.08
3.60
1.10
5.80
0.30
3.98
6.10
0.20
3.99
θ
b
d
e
g
0°
0.33
12°
0.51
1.27BSC
1.35
1.10
1.75
-
ID(A)
15
14
Drain
VDS(V)
RDS(on) (m
15@VGS= 10V
18@VGS= 4.5V
G
40
Gate
Source
ABSOLUTE MAXIMUM RATINGS AND THERMAL DATA(TA = 25°C unless otherwise specified)
PARAMETER
Drain-Source Voltage
SYMBOL
VDS
RATING
UNIT
40
V
Gate-Source Voltage
VGS
20
V
TA=25°C
TA=70°C
15
Continuous Drain Current A
ID
A
13
Pulsed Drain Current B
Continuous Source Current (Diode Conduction) A
IDM
IS
50
A
A
2.3
TA=25°C
TA=70°C
5.0
Power Dissipation A
PD
W
3.2
Operating Junction and Storage Temperature Range
TJ, TSTG
-55 ~ 150
°C
THERMAL RESISTANCE DATA
t≦10 sec
RθJA
25
65
Maximum Junction to Ambient A
°C / W
Steady-State
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
28-Jul-2010 Rev. A
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