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SSP7440N PDF预览

SSP7440N

更新时间: 2024-09-16 09:04:43
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描述
N-Channel Enhancement MOSFET

SSP7440N 数据手册

 浏览型号SSP7440N的Datasheet PDF文件第2页 
SSP7440N  
15 A, 40 V, RDS(ON) 15 m  
N-Channel Enhancement MOSFET  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen & lead-free  
SOP-8PP  
DESCRIPTION  
B
These miniature surface mount MOSFETs utilize a high cell density trench process  
to provide low RDS(on) and to ensure minimal power loss and heat dissipation.  
Typical applications are DC-DC converters and power management in  
portable and battery-powered products such as computers, printers,  
PCMCIA cards, cellular and cordless telephones.  
D
C
θ
e
E
FEATURES  
Low RDS(on) provides higher efficiency and extends battery life.  
Low thermal impedance copper leadframe SOP-8PP saves board  
space.  
A
b
d
g
Fast switching speed.  
High performance trench technology.  
F
G
Millimeter  
Min. Max.  
Millimeter  
REF.  
REF.  
Min.  
Max.  
PRODUCT SUMMARY  
PRODUCT SUMMARY  
A
B
C
D
E
F
1.00  
5.70  
0.20  
3.61  
5.40  
0.08  
3.60  
1.10  
5.80  
0.30  
3.98  
6.10  
0.20  
3.99  
θ
b
d
e
g
0°  
0.33  
12°  
0.51  
1.27BSC  
1.35  
1.10  
1.75  
-
ID(A)  
15  
14  
  
Drain  
VDS(V)  
RDS(on) (m  
15@VGS= 10V  
18@VGS= 4.5V  
G
40  
  
Gate  
  
Source  
ABSOLUTE MAXIMUM RATINGS AND THERMAL DATA(TA = 25°C unless otherwise specified)  
PARAMETER  
Drain-Source Voltage  
SYMBOL  
VDS  
RATING  
UNIT  
40  
V
Gate-Source Voltage  
VGS  
20  
V
TA=25°C  
TA=70°C  
15  
Continuous Drain Current A  
ID  
A
13  
Pulsed Drain Current B  
Continuous Source Current (Diode Conduction) A  
IDM  
IS  
50  
A
A
2.3  
TA=25°C  
TA=70°C  
5.0  
Power Dissipation A  
PD  
W
3.2  
Operating Junction and Storage Temperature Range  
TJ, TSTG  
-55 ~ 150  
°C  
THERMAL RESISTANCE DATA  
t10 sec  
RθJA  
25  
65  
Maximum Junction to Ambient A  
°C / W  
Steady-State  
Notes  
a. Surface Mounted on 1” x 1” FR4 Board.  
b. Pulse width limited by maximum junction temperature.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
28-Jul-2010 Rev. A  
Page 1 of 2  

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