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SSM6J07FU(TE85L,F) PDF预览

SSM6J07FU(TE85L,F)

更新时间: 2024-09-25 15:52:55
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
5页 196K
描述
SSM6J07FU(TE85L,F)

SSM6J07FU(TE85L,F) 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:,Reach Compliance Code:unknown
风险等级:5.84Base Number Matches:1

SSM6J07FU(TE85L,F) 数据手册

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SSM6J07FU  
TOSHIBA Transistor Silicon P Channel MOS Type  
SSM6J07FU  
Power Management Switch  
Unit: mm  
High Speed Switching Applications  
Small package  
Low on resistance  
: RDS(ON) = 450 m(max) (V  
: RDS(ON) = 800 m(max) (V  
= 10 V)  
= 4 V)  
GS  
GS  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
30  
±20  
V
V
DS  
Gate-source voltage  
V
GSS  
DC  
I
0.8  
D
Drain current  
A
Pulse  
I
1.6  
DP  
Drain power dissipation  
Channel temperature  
P
(Note 1)  
300  
mW  
°C  
D
T
ch  
150  
JEDEC  
JEITA  
Storage temperature range  
T
55 to 150  
°C  
stg  
TOSHIBA  
2-2J1D  
Note:  
Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
Weight: 6.8 mg (typ.)  
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Mounted on FR4 board  
2
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.32 mm × 6)  
Marking  
Equivalent Circuit  
(top view)  
Figure 1: 25.4 mm × 25.4 mm × 1.6 t,  
Cu Pad: 0.32 mm  
2 × 6  
6
5
K D F  
2
4
3
6
5
4
0.4 mm  
1
1
2
3
Handling Precaution  
When handling individual devices (which are not yet mounting on a circuit board), be sure that the environment is  
protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other  
objects that come into direct contact with devices should be made of anti-static materials.  
1
2009-10-07  

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