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SSM4K27CT PDF预览

SSM4K27CT

更新时间: 2024-09-23 04:02:43
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体小信号场效应晶体管开关
页数 文件大小 规格书
5页 203K
描述
Switching Applications

SSM4K27CT 技术参数

生命周期:End Of Life包装说明:CHIP CARRIER, R-XBCC-N4
针数:4Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.32
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):0.5 A最大漏极电流 (ID):0.5 A
最大漏源导通电阻:0.26 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XBCC-N4元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):0.4 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:NO LEAD
端子位置:BOTTOM晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SSM4K27CT 数据手册

 浏览型号SSM4K27CT的Datasheet PDF文件第2页浏览型号SSM4K27CT的Datasheet PDF文件第3页浏览型号SSM4K27CT的Datasheet PDF文件第4页浏览型号SSM4K27CT的Datasheet PDF文件第5页 
SSM4K27CT  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (U-MOS)  
SSM4K27CT  
Switching Applications  
Unit: mm  
Suitable for high-density mounting due to compact package  
Top view  
0.8±0.05  
0.5  
0.05±0.04  
0.2±0.02  
Low on-resistance:  
R
on  
R
on  
R
on  
= 205 m(max) (@V  
= 260 m(max) (@V  
= 390 m(max) (@V  
= 4.0 V)  
= 2.5 V)  
= 1.8 V)  
GS  
GS  
GS  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-Source voltage  
Symbol  
Rating  
Unit  
V
20  
±12  
V
V
DS  
Side view  
Gate-Source voltage  
V
GSS  
DC  
I
0.5  
D
Drain current  
A
Pulse  
I
1.0  
DP  
Drain power dissipation  
Channel temperature  
PD (Note 1)  
400  
mW  
°C  
1
:Gate 2:Source  
3,4:Drain  
CST4  
T
ch  
150  
Storage temperature range  
T
stg  
55~150  
°C  
JEDEC  
JEITA  
Note: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
TOSHIBA  
2-1M1A  
Weight: 1.1 mg (typ.)  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and  
individual reliability data (i.e. reliability test report and estimated failure rate, etc).  
Note 1: Mounted on FR4 board.  
2
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 645 mm )  
Marking (top view) Electrode Layout (bottom view) Equivalent Circuit (top view)  
4
3
3
2
4
1
4
1
3
2
1
2
Polarity marking  
1
2
3
4
Gate  
Source  
Drain  
Drain  
Handling Precaution  
When handling individual devices (which are not yet mounted on a circuit board), ensure that the environment is  
protected against static electricity. Operators should wear anti-static clothing, and containers and other objects that come  
into direct contact with devices should be made of anti-static materials.  
1
2007-11-01  

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