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SSM3J13T(TE85L) PDF预览

SSM3J13T(TE85L)

更新时间: 2024-11-20 20:11:15
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
6页 218K
描述
SSM3J13T(TE85L)

SSM3J13T(TE85L) 技术参数

生命周期:ActiveReach Compliance Code:unknown
风险等级:5.57Base Number Matches:1

SSM3J13T(TE85L) 数据手册

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SSM3J13T  
TOSHIBA Field Effect Transistor  
Silicon P Channel MOS Type (U-MOSII)  
SSM3J13T  
Power Management Switch  
Unit: mm  
High Speed Switching Applications  
Small Package  
Low on Resistance: R = 70 m(max) (@V  
= 4 V)  
= 2.5 V)  
on  
GS  
GS  
: R = 95 m(max) (@V  
on  
Low Gate Threshold Voltage  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-Source voltage  
Symbol  
Rating  
Unit  
12  
±8  
V
V
V
DS  
Gate-Source voltage  
V
GSS  
DC  
I
3.0  
D
Drain current  
A
I
DP  
Pulse  
6.0  
(Note 2)  
P
D
Drain power dissipation  
Channel temperature  
1.25  
W
JEDEC  
JEITA  
(Note 1)  
T
ch  
150  
°C  
°C  
Storage temperature range  
T
stg  
55~150  
TOSHIBA  
2-3S1A  
Weight: 10 mg (typ.)  
Note:  
Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating  
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Mounted on FR4 board  
2
(25.4 mm × 25.4 mm × 1.6 t, Cu pad: 645 mm , t = 10 s)  
Note 2: The pulse width limited by max channel temperature.  
Marking  
Equivalent Circuit  
3
3
KDH  
1
2
1
2
Handling Precaution  
When handling individual devices (which are not yet mounted on a circuit board), be sure that the  
environment is protected against electrostatic electricity. Operators should wear anti-static clothing, and  
containers and other objects that come into direct contact with devices should be made of anti-static materials.  
The Channel-to-Ambient thermal resistance R  
and the drain power dissipation P vary according to  
D
th (ch-a)  
the board material, board area, board thickness and pad area, and are also affected by the environment in  
which the product is used. When using this device, please take heat dissipation fully into account  
1
2007-11-01  

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