SS860T
Surface Mount Schottky Barrier Rectifiers
Features
SMB/DO-214AA
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Ideal for automated placement
0.180(4.57)
0.160(4.06)
Ultra low forward voltage drop, low power losses
High efficiency Operation
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0.086(2.20)
0.077(1.95)
0.155(3.94)
0.130(3.30)
Low thermal resistanc
Lead free in comply with EU RoHS 2011/65/EU directives.
Green molding compound as per IEC61249 Std. . (Halogen Free)
0.209(5.30)
0.201(5.10)
0.012(0.30)
0.006(0.15)
Mechanical Data
0.096(2.44)
0.084(2.13)
Case:JEDEC SMB,molded plastic over
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0.059(1.50)
0.035(0.90)
1111passivated chip
Polarity: Color band denotes cathode end
0.008(0.20)
0.002(0.05)
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Weight: 0.093 gram
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Dimensions in inches and(millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25oC ambient temperature unless otherwise specified
SS860T
UNITS
Maximumrecurrent peak reverse voltage
Maximum RMS voltage
VRRM
VRWS
VDC
60
42
60
V
V
V
MaximumDC blocking voltage
Maximumaverage forw ord rectified current at
8.0
150
0.53
I(AV)
A
A
c
TL(SEEFIG.1) (NOTE2)
Peak forw ard surge current 8.3ms single half-
c sine-w ave superimposed on rated load(JEDEC
c Method)
IFSM
Maximuminstantaneous forw ard voltage at
VF
V
V
v 8.0A(NOTE.1)
Typical Junction Capacitance (VR=4V, f=1MHz)
MaximumDC reverse current @TA=25oC
410
Cj
0.5
IR
mA
at rated DC blockjing voltage(NOTE1) @TA=100oC
20
55
Rθ
JA
oC/W
Typical thermal resitance (NOTE2)
17
Rθ
JL
oC
oC
Operating junction temperature range
Storage temperature range
TJ
-55--- +150
-55--- +150
TSTG
NOTE: 1.Pulse test:300 S pulse width,1%duty cycle
μ
2. P.C.B.mounted with 0.55"X0.55"(14.0X14.0mm2)copper pad areas
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mail:lge@lgesemi.com
Revision:20170701-P1