SS275TA12205, SS275TC12205, SS275TI12205
VRRM = 1200 V
Silicon Carbide Schottky Diode
Part Number
VRRM (V)
IF(AVG) (A) Configuration
IF(AVG)
CJ
=
5 A
SS275TA12205
SS275TC12205
SS275TI12205
1200
5
5
5
Triple Common Anode
= 90 pF
1200
Triple Common Cathode
Triple Independent
1200
Triple Anode (TA)
Triple Cathode (TC)
Triple Independent (TI)
A = Anode C = Cathode
Symbol Parameter per diode
Test Conditions Maximum Ratings
Features
VRRM
Repetitive Peak Reverse Voltage
Repetitive Surge Reverse Voltage
DC Blocking Voltage
1200
1200
1200
5
V
V
V
A
1200 V SiC Schottky Diode
Surface Mount Package
Zero Reverse Recovery
VRSM
VDC
Zero Forward Recovery
Average Forward Current
High-Frequency Operation
Temperature-Independent Behavior
Positive Temperature Coefficient for V
IF(AVG)
TJ = 175°C
TC = 25°C, tP = 8 ms
Half Sine Wave
Repetitive Peak Forward Surge Current
Non-Repetitive Peak Forward Surge Current
Operating Virtual Junction Temperature
30
100
A
A
IFRM
F
Applications
TC = 25°C, tP = 10 µs
Pulse
IFSM
TVJ
MHz Switch Mode Power Supplies
High-Frequency Converters
Resonant Converters
-55 to +175
°C
Rectifier Circuits
TSTG
PTOT
Storage Temperature
-55 to +175
°C
W
100
TC = 25 °C (33.3 W per diode)
Symbol
Parameter per diode
Test Conditions
Characteristic Values
TJ = 25°C unless otherwise specified
Typ.
Max. Units
Forward Voltage
VF
IF = 5 A, TJ = 25°C
TJ = 175°C
1.5
2.5
1.8
V
3
Reverse Current
IR
VR = 1200 V, TJ = 25°C
TJ = 175°C
50
100
200
μA
1000
Junction Capacitance
f = 1 MHz, VR = 0 V
VR = 200 V
575
120
90
CJ
pF
VR = 1200 V
Capacitive Charge
VR = 1200 V
108
1.5
nC
°C/W
°C
QC
Thermal Resistance
RTHJC
Lead Soldering Temperature
1.6 mm (0.063 in) from case for 10 s
300
TL
Pin to Substrate
Isolation
>2000
>1700
V
RMS
Pin to Pin
2
g
Weight