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SS26-TP PDF预览

SS26-TP

更新时间: 2024-11-19 21:08:55
品牌 Logo 应用领域
美微科 - MCC 光电二极管
页数 文件大小 规格书
4页 209K
描述
Rectifier Diode, Schottky, 1 Phase, 1 Element, 2A, 60V V(RRM), Silicon, DO-214AC, ROHS COMPLIANT, PLASTIC, SMA, 2 PIN

SS26-TP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Not Recommended零件包装代码:DO-214AC
包装说明:R-PDSO-C2针数:2
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:7.57
应用:GENERAL PURPOSE配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
最大正向电压 (VF):0.7 VJEDEC-95代码:DO-214AC
JESD-30 代码:R-PDSO-C2JESD-609代码:e3
湿度敏感等级:1最大非重复峰值正向电流:50 A
元件数量:1相数:1
端子数量:2最高工作温度:125 °C
最低工作温度:-55 °C最大输出电流:2 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
认证状态:Not Qualified最大重复峰值反向电压:60 V
子类别:Rectifier Diodes表面贴装:YES
技术:SCHOTTKY端子面层:Matte Tin (Sn)
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:10Base Number Matches:1

SS26-TP 数据手册

 浏览型号SS26-TP的Datasheet PDF文件第2页浏览型号SS26-TP的Datasheet PDF文件第3页浏览型号SS26-TP的Datasheet PDF文件第4页 
NOT RECOMMENDED FOR NEW DESIGNS  
USE SS22-LTP~SS210-LTP SERIES  
M C C  
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20736 Marilla Street Chatsworth  
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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
SS22  
THRU  
SS210  
TM  
Micro Commercial Components  
Features  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
2 Amp Schottky  
Rectifier  
20 to 100 Volts  
Compliant. See ordering information)  
Low Forward Voltage  
Low Forward Voltage  
·
Guard Ring Protection  
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
·
DO-214AC  
(SMA) (High Profile)  
Maximum Ratings  
Operating Temperature: -55°C to +125°C  
Storage Temperature: -55°C to +150°C  
Maximum Thermal Resistance: RthjL-15°C/W; Rthja-73 °C/W  
H
Cathode Band  
MCC  
Catalog  
Number  
Device  
Marking  
Maximum  
Recurrent  
Peak Reverse  
Voltage  
20V  
Maximum  
RMS  
Voltage  
Maximum  
DC  
Blocking  
Voltage  
20V  
30V  
40V  
50V  
60V  
80V  
100V  
J
SS22  
SS23  
SS24  
SS25  
SS26  
SS28  
SS210  
SS22  
SS23  
SS24  
SS25  
SS26  
SS28  
SS210  
14V  
21V  
28V  
35V  
42V  
56V  
70V  
30V  
40V  
50V  
60V  
80V  
100V  
A
C
E
D
B
F
G
DIMENSIONS  
Electrical Characteristics @ 25°C Unless Otherwise Specified  
INCHES  
MIN  
.078  
.067  
.002  
---  
MM  
MIN  
Average Forward  
Current  
IF(AV)  
2.0A  
TJ = 100°C  
DIM  
A
MAX  
.116  
.089  
.008  
.02  
MAX  
2.95  
2.25  
.20  
NOTE  
1.98  
1.70  
.05  
B
Peak Forward Surge  
Current  
IFSM  
50A  
8.3ms, half sine  
C
D
E
---  
.51  
.035  
.065  
.205  
.160  
.100  
.055  
.096  
.224  
.180  
.112  
.89  
1.40  
2.45  
5.69  
4.57  
2.84  
Maximum  
F
1.65  
5.21  
4.06  
2.57  
G
H
J
Instantaneous  
Forward Voltage  
SS22-SS24  
SS25-SS26  
SS28-SS210  
VF  
.55V  
.70V  
.85V  
IFM = 2.0A;  
TJ = 25°C*  
SUGGESTED SOLDER  
PAD LAYOUT  
Maximum DC Reverse  
Current At Rated DC  
Blocking Voltage  
0.090”  
IR  
0.5mA  
TJ = 25°C  
0.085”  
Typical Junction  
Capacitance  
SS22  
CJ  
230pF  
50pF  
Measured at  
1.0MHz, VR=4.0V  
0.070”  
SS23-SS210  
*Pulse test: Pulse width 300 µsec, Duty cycle 2%  
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
www.mccsemi.com  
1 of 4  
Revision: C  
2011/11/01  

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