SS12 THRU SS100
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Reverse Voltage - 20 to 100 Volts
Forward Current - 1.0 Ampere
FEATURES
SMA(DO-214AC)
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The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
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For surface mounted applications
Metal silicon junction,majority carrier conduction
Low reverse leakage
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
250 C/10 seconds at terminals
.062(1.60)
.055(1.40)
.114(2.90)
.098(2.50)
.181(4.60)
.157(4.00)
.012(.305)
.006(.152)
MECHANICAL DATA
.103(2.62)
.079(2.00)
Case: JEDEC DO-214AC molded plastic body
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
.008(.203)
.002(.051)
.060(1.52)
.030(0.76)
.208(5.28)
.188(4.80)
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.003 ounce, 0.093 grams
0.004 ounce, 0.111 grams SMA(H)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Characteristic
SYMBOLS
SS18 SS100
SS12 SS13 SS14 SS15 SS16
UNITS
20
14
20
30
21
30
40
28
40
50
35
50
60
42
60
80
56
80
100
70
Maximum repetitive peak reverse voltage
Maximum RMS voltage
V
V
V
V
RRM
RMS
V
100
Maximum DC blocking voltage
V
DC
Maximum average forward rectified current
I
(AV)
1.0
A
at TL(see fig.1)
Peak forward surge current
I
FSM
40.0
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
A
V
F
0.50
0.70
0.85
Maximum instantaneous forward voltage at 1.0A
V
Maximum DC reverse current
at rated DC blocking voltage
T
A
=25℃
0.5
mA
I
R
T
A
=100℃
6.0
5.0
90
pF
℃/W
℃
Typical junction capacitance (NOTE 1)
C
J
110
Typical thermal resistance (NOTE 2)
Operating junction temperature range
R
T
JA
88.0
-65 to +150
-65 to +150
-65 to +125
J,
Storage temperature range
℃
T
STG
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas