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SRE6603-472M PDF预览

SRE6603-472M

更新时间: 2024-11-30 12:18:43
品牌 Logo 应用领域
伯恩斯 - BOURNS 电感器固定电感器测试功率感应器
页数 文件大小 规格书
2页 270K
描述
Shielded SMD Power Inductors

SRE6603-472M 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:2618
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8504.50.80.00Factory Lead Time:18 weeks
风险等级:5.46Is Samacsys:N
大小写代码:2618构造:Shielded
型芯材料:FERRITE直流电阻:13.9 Ω
标称电感 (L):4700 µH电感器应用:POWER INDUCTOR
电感器类型:GENERAL PURPOSE INDUCTORJESD-609代码:e4
功能数量:1端子数量:2
最高工作温度:105 °C最低工作温度:-25 °C
封装高度:2.92 mm封装长度:6.6 mm
封装形式:SMT封装宽度:4.45 mm
包装方法:TR, 13 Inch最小质量因数(标称电感时):50
最大额定电流:0.06 A自谐振频率:1 MHz
形状/尺寸说明:RECTANGULAR PACKAGE屏蔽:YES
表面贴装:YES端子面层:Silver/Nickel/Gold (Ag/Ni/Au)
端子位置:DUAL ENDED端子形状:WRAPAROUND
测试频率:0.1 MHz容差:20%
Base Number Matches:1

SRE6603-472M 数据手册

 浏览型号SRE6603-472M的Datasheet PDF文件第2页 
Features  
Applications  
Unit height of 2.9 mm  
Inductance range: 1500 to 10,000 μH  
Rated current up to 0.12 A  
RoHS compliant*  
DC/DC converters  
Power supplies for:  
• Portable communication equipment  
• Laptop computers  
±±±  
• Camcorders, HDTV, car audio systems  
SRE6603 Series - Shielded SMD Power Inductors  
Electrical Characteristics  
General Specifications  
Test Voltage....................................0.1 V  
Reflow Soldering ... 230 °C, 50 sec max.  
Operating Temperature  
Test  
Frequen-  
cy  
Inductance  
@ 100 KHz  
SRF  
(MHz)  
Typ.  
DCR  
(Ω)  
Q
I rms  
(A)  
I sat  
(A)  
Bourns Part No. L (μH) ±±0 ꢀ (Ref.)  
(KHz)  
Max.  
................................-25 °C to +105 °C  
(Temperature rise included)  
SRE6603-152M  
SRE6603-222M  
SRE6603-332M  
SRE6603-472M  
SRE6603-682M  
SRE6603-103M  
1500  
2200  
3300  
4700  
6800  
10,000  
50  
50  
50  
50  
50  
50  
100  
100  
100  
100  
100  
100  
2
2
4.2  
8.5  
11  
13.9  
25  
32.8  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0.035  
0.028  
0.024  
0.021  
0.019  
0.017  
Storage Temperature  
................................-40 °C to +125 °C  
Resistance to Soldering Heat  
1
1
...............................260 °C for 10 sec.  
1
0.8  
Materials  
Core..............................................Ferrite  
Wire ............................Enameled copper  
Base ..........................................Ceramic  
Adhesive.............................. Epoxy resin  
Terminal....................................Ag/Ni/Au  
Rated Current  
Schematic  
Recommended Layout  
6.86  
(0.270)  
3.56  
(0.140)  
REF.  
...............Ind. drop of 30 % typ. at Isat  
Temperature Rise...40 °C typical at Irms  
Packaging..... 2000 pcs. per 13-inch reel  
4.06  
(0.160)  
1.4  
1.4  
(0.055)  
(0.055)  
Product Dimensions  
Soldering Profile  
6.60  
(0.260)  
MAX.  
275  
260 °C peak  
<1>Maximum of 10 seconds  
between +255 °C and +260 °C  
<1> 255 °C  
220 °C  
225  
175  
190°C  
Ramp Down  
5 °C/second  
60 seconds  
maximum  
4.45  
(0.175)  
MAX.  
150 °C  
125  
75  
120-150 seconds  
10 seconds minimum  
1.27 0.2  
(0.050 0.008)  
Ramp Up  
4 °C/second maximum  
25  
0
50  
100  
150  
200  
250  
300  
Time (Seconds)  
4.32 0.3  
(0.170 0.012)  
1.02 0.2  
(0.040 0.008)  
3.90 0.3  
(0.154 0.012)  
2.92  
(0.115)  
MAX.  
MM  
(INCHES)  
DIMENSIONS:  
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  

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