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SQJQ980EL-T1_GE3 PDF预览

SQJQ980EL-T1_GE3

更新时间: 2024-11-20 22:57:23
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 243K
描述
MOSFET 2 N-CH 80V POWERPAK8X8

SQJQ980EL-T1_GE3 数据手册

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SQJQ980EL  
Vishay Siliconix  
www.vishay.com  
Automotive Dual N-Channel 80 V (D-S) 175 °C MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
PowerPAK® 8 x 8L Dual  
• AEC-Q101 qualified  
D1  
• 100 % Rg and UIS tested  
• Fully lead (Pb)-free device  
D2  
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
1
G1  
2
S1  
3
S2  
1
4
G2  
D
1
D
2
Top View  
Bottom View  
PRODUCT SUMMARY  
VDS (V)  
80  
0.0135  
0.0170  
36  
G
1
G
2
R
DS(on) () at VGS = 10 V  
DS(on) () at VGS = 4.5 V  
R
ID (A) per leg  
Configuration  
Package  
Dual  
S
1
S
2
N-Channel MOSFET  
PowerPAK 8 x 8L  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
80  
V
VGS  
20  
T
C = 25 °C a  
C = 125 °C  
36  
Continuous drain current  
ID  
T
21  
Continuous source current (diode conduction) a  
Pulsed drain current b  
IS  
34  
128  
A
IDM  
IAS  
Single pulse avalanche current  
Single pulse avalanche energy  
27  
L = 0.1 mH  
EAS  
36  
mJ  
W
TC = 25 °C  
187  
Maximum power dissipation b  
PD  
TC = 125 °C  
62  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
-55 to +175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
LIMIT  
100  
UNIT  
Junction-to-ambient  
PCB mount c  
°C/W  
Junction-to-case (drain)  
RthJC  
4.0  
Notes  
a. Package limited  
b. Pulse test; pulse width 300 μs, duty cycle 2 %  
c. When mounted on 1" square PCB (FR4 material)  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 8 x 8L is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
S17-0465-Rev. B, 27-Mar-17  
Document Number: 76465  
1
For technical questions, contact: automostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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