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SQJQ904E-T1_GE3

更新时间： 2024-11-05 22:57:51
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 262K
描述
MOSFET 2 N-CH 40V POWERPAK8X8

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SQJQ904E-T1_GE3 数据手册

 浏览型号SQJQ904E-T1_GE3的Datasheet PDF文件第2页浏览型号SQJQ904E-T1_GE3的Datasheet PDF文件第3页浏览型号SQJQ904E-T1_GE3的Datasheet PDF文件第4页浏览型号SQJQ904E-T1_GE3的Datasheet PDF文件第5页浏览型号SQJQ904E-T1_GE3的Datasheet PDF文件第6页浏览型号SQJQ904E-T1_GE3的Datasheet PDF文件第7页 
SQJQ904E  
Vishay Siliconix  
www.vishay.com  
Automotive Dual N-Channel 40 V (D-S) 175 °C MOSFET  
FEATURES  
PowerPAK® 8 x 8L Dual  
• TrenchFET® power MOSFET  
• AEC-Q101 qualified  
• 100 % Rg and UIS tested  
D1  
• Material categorization:  
D2  
for definitions of compliance please see  
www.vishay.com/doc?99912  
1
G1  
2
S1  
3
S2  
1
4
G2  
D
1
D
2
Top View  
Bottom View  
PRODUCT SUMMARY  
VDS (V)  
G
1
G
2
40  
0.0034  
100  
RDS(on) () at VGS = 10 V  
ID (A) per leg  
S
1
S
2
Configuration  
Package  
Dual  
N-Channel MOSFET  
N-Channel MOSFET  
PowerPAK 8 x 8L  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
40  
20  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
T
C = 25 °Ca  
C = 125 °C  
100  
64  
Continuous drain current  
ID  
T
Continuous source current (diode conduction) a  
Pulsed drain current b  
IS  
100  
300  
50  
A
IDM  
IAS  
Single pulse avalanche current  
Single pulse avalanche energy  
L = 0.1 mH  
EAS  
125  
75  
mJ  
W
TC = 25 °C  
Maximum power dissipation b  
PD  
TC = 125 °C  
25  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
-55 to +175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
LIMIT  
85  
UNIT  
Junction-to-ambient  
PCB mount c  
°C/W  
Junction-to-case (drain)  
RthJC  
2
Notes  
a. Package limited.  
b. Pulse test; pulse width 300 μs, duty cycle 2 %.  
c. When mounted on 1" square PCB (FR4 material).  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 8 x 8L is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
S17-0256-Rev. A, 20-Feb-17  
Document Number: 68442  
1
For technical questions, contact: automostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
1234567...10

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