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SQJB60EP PDF预览

SQJB60EP

更新时间: 2024-09-17 14:52:55
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 411K
描述
Automotive Dual N-Channel 60 V (D-S) 175 °C MOSFET

SQJB60EP 数据手册

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SQJB60EP  
Vishay Siliconix  
www.vishay.com  
Automotive Dual N-Channel 60 V (D-S) 175 °C MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
PowerPAK® SO-8L Dual  
• AEC-Q101 qualified  
D1  
• 100 % Rg and UIS tested  
• Material categorization:  
D2  
for definitions of compliance please see  
www.vishay.com/doc?99912  
1
S1  
2
G1  
3
S2  
4
G2  
D
1
D
2
1
Top View  
Bottom View  
PRODUCT SUMMARY  
VDS (V)  
G
1
G
60  
0.012  
0.016  
30  
2
R
DS(on) (Ω) at VGS = 10 V  
DS(on) (Ω) at VGS = 4.5 V  
R
ID (A) per leg  
S
1
S
2
Configuration  
Dual  
N-Channel MOSFET  
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
PowerPAK SO-8L  
SQJB60EP-T1  
(for detailed order number please see www.vishay.com/doc?79771)  
Lead (Pb)-free and halogen-free  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
60  
V
VGS  
20  
T
T
C = 25 °C a  
C = 125 °C  
30  
Continuous Drain Current  
ID  
26  
Continuous Source Current (Diode conduction) a  
Pulsed Drain Current b  
IS  
30  
A
IDM  
IAS  
84  
23  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
L = 0.1 mH  
EAS  
26.5  
mJ  
W
TC = 25 °C  
48  
Maximum Power Dissipation b  
PD  
TC = 125 °C  
16  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak temperature) d, e  
TJ, Tstg  
-55 to +175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
LIMIT  
85  
UNIT  
Junction-to-Ambient  
PCB mount c  
°C/W  
Junction-to-Case (Drain)  
RthJC  
3.1  
Notes  
a. Package limited  
b. Pulse test; pulse width 300 μs, duty cycle 2 %  
c. When mounted on 1" square PCB (FR4 material)  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
S22-0167-Rev. B, 14-Feb-2022  
Document Number: 77774  
1
For technical questions, contact: automostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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