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SQJA60EP-T1_GE3 PDF预览

SQJA60EP-T1_GE3

更新时间: 2024-09-16 22:56:15
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 287K
描述
MOSFET N-CH 60V 30A POWERPAKSO-8

SQJA60EP-T1_GE3 数据手册

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SQJA60EP  
Vishay Siliconix  
www.vishay.com  
Automotive N-Channel 60 V (D-S) 175 °C MOSFET  
FEATURES  
PowerPAK® SO-8L Single  
• TrenchFET® power MOSFET  
• AEC-Q101 qualified  
• 100 % Rg and UIS tested  
D
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
1
S
2
S
3
S
D
4
1
G
Top View  
Bottom View  
PRODUCT SUMMARY  
VDS (V)  
G
60  
R
DS(on) (Ω) at VGS = 10 V  
DS(on) (Ω) at VGS = 4.5 V  
0.0125  
0.0160  
30  
R
N-Channel MOSFET  
S
ID (A)  
Configuration  
Single  
ORDERING INFORMATION  
Package  
PowerPAK SO-8L  
SQJA60EP  
Lead (Pb)-free and halogen-free  
(for detailed order number please see www.vishay.com/doc?79771)  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
60  
V
VGS  
20  
T
C = 25 °C a  
C = 125 °C  
30  
Continuous drain current  
ID  
T
24.6  
Continuous source current (diode conduction) a  
Pulsed drain current b  
IS  
30  
A
IDM  
IAS  
84  
Single pulse avalanche current  
Single pulse avalanche energy  
23  
L = 0.1 mH  
EAS  
26  
45  
mJ  
W
TC = 25 °C  
Maximum power dissipation b  
PD  
TC = 125 °C  
15  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
-55 to +175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
LIMIT  
70  
UNIT  
Junction-to-ambient  
PCB mount c  
°C/W  
Junction-to-case (drain)  
RthJC  
3.3  
Notes  
a. Package limited  
b. Pulse test; pulse width 300 μs, duty cycle 2 %  
c. When mounted on 1" square PCB (FR4 material)  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
S21-0849-Rev. B, 16-Aug-2021  
Document Number: 75020  
1
For technical questions, contact: automostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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