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SQJ479EP-T1_GE3 PDF预览

SQJ479EP-T1_GE3

更新时间: 2024-11-05 22:57:59
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 248K
描述
MOSFET P-CH 80V 32A POWERPAKSO-8

SQJ479EP-T1_GE3 数据手册

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SQJ479EP  
Vishay Siliconix  
www.vishay.com  
Automotive P-Channel 80 V (D-S) 175 °C MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
PRODUCT SUMMARY  
VDS (V)  
-80  
0.033  
• AEC-Q101 qualified  
RDS(on) () at VGS = -10 V  
RDS(on) () at VGS = -4.5 V  
0.044  
• 100 % Rg and UIS tested  
ID (A)  
-32  
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
Configuration  
Package  
Single  
PowerPAK SO-8L  
PowerPAK® SO-8L Single  
S
D
G
1
S
2
S
3
S
4
D
1
G
P-Channel MOSFET  
Top View  
Bottom View  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
SYMBOL  
LIMIT  
-80  
UNIT  
VDS  
V
VGS  
20  
T
C = 25 °C  
-32  
Continuous Drain Current  
ID  
TC = 125 °C  
-18  
Continuous Source Current (Diode Conduction) a  
Pulsed Drain Current b  
IS  
-60  
A
IDM  
IAS  
EAS  
-100  
-40  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
L = 0.1 mH  
80  
mJ  
W
TC = 25 °C  
68  
Maximum Power Dissipation b  
PD  
TC = 125 °C  
22  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature) d, e  
TJ, Tstg  
-55 to +175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Junction-to-Ambient  
SYMBOL  
RthJA  
LIMIT  
68  
UNIT  
PCB Mountc  
°C/W  
Junction-to-Case (Drain)  
RthJC  
2.2  
Notes  
a. Package limited.  
b. Pulse test; pulse width 300 μs, duty cycle 2 %.  
c. When mounted on 1" square PCB (FR4 material).  
d. See solder profile (www.vishay.com/doc?73257). For PowerPAK SO-8L, the end of the lead terminal is exposed copper (not plated) as a  
result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to  
ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
S16-1071-Rev. A, 30-May-16  
Document Number: 75129  
1
For technical questions, contact: automostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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