生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | TSSOP, TSSOP8,.25 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 12 weeks |
风险等级: | 1.35 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 670227 |
Samacsys Pin Count: | 8 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Small Outline Packages | Samacsys Footprint Name: | TSSOP8 |
Samacsys Released Date: | 2019-07-30 08:12:43 | Is Samacsys: | N |
模拟集成电路 - 其他类型: | ANALOG CIRCUIT | JESD-30 代码: | R-PDSO-G8 |
长度: | 4.4 mm | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TSSOP8,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 0.5/5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 0.08 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 0.3 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3 mm | Base Number Matches: | 1 |
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