SPM1011C
SENSITRON
SEMICONDUCTOR
DATASHEET 5487, REV F
1200 VOLT, 40 AMP MOSFET FULL-BRIDGE MODULE
Features
• Isolated base plate
• Light weight low profile standard package
• Aluminum Nitride substrate
• High temperature engineering plastic shell construction
• Enhanced die coating
• Die back metal change from silver to gold
ELECTRICAL CHARACTERISTICS PER MOSFET LEG
(TJ=25°C UNLESS OTHERWISE SPECIFIED)
SYMBOL
PARAMETER
MIN
TYP
MAX
UNIT
MOSFET SPECIFICATIONS
Drain to Source Breakdown Voltage
ID = 100 A, VGS = 0V
Continuous Drain Current
BVDSS
1200
-
-
-
-
V
A
TC = 25°C
TC = 100°C
60
40
160
-10/+25
250
ID
ID(pulse)
VGS
Pulsed Drain Current, 1ms
Gate to Source Voltage
-
-
-
-
-
-
A
V
IGSS
Gate-Source Leakage Current , VGS = +20V / -5V
nA
Gate Threshold Voltage,
ID = 10mA, VDS = VGS
Zero Gate Voltage Drain Current
VDS = 1200 V, VGS=0V
Drain-Source On-State Resistance
ID = 40A, VGS = 20V
Input Capacitance
Output Capacitance
Reverse Transfer Cap.
VDS = 1000 V, VGS = 0 V, f = 1 MHz, VAC = 25 mV
TJ = 25°C
TJ = 150°C
2.0
1.4
3.2
2.3
4.0
3.2
VGS(th)
IDSS
V
-
1
100
µA
mΩ
TJ = 25°C
TJ = 150°C
-
-
-
-
-
47
98
2287
157
8
56
118
-
-
-
RDS(on)
Ciss
Coss
Crss
pF
ns
Turn On Delay Time
Rise Time
Turn Off Delay Time
Fall Time
tD(on)
tR
tD(off)
tF
-
-
-
-
15
52
26
34
-
-
-
-
VDS = 800 V, ID = 40A, VGS = -5/+20V, RG = 2.5, RL = 20
Avalanche Energy, Single Pulse
ID = 40A, VDS = 50V
EAS
-
2
-
J
Turn on Energy Loss
Turn off Energy Loss
EON
EOFF
-
-
1000
400
-
-
µJ
Ω
VDS = 800 V, ID = 40A, VGS = -5/+20V, RG = 2.5, L = 80µH
Internal Gate Resistance
f = 1MHz, VAC = 25mV
Gate to Source Charge
Gate to Drain Charge
RG(int)
-
-
1.8
-
-
QGS
QGD
QG
29
45
131
nC
Total Gate Charge
VDS = 800 V, ID = 40A, VGS = -5/+20V
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