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SPC5746CHK1ACMJ6 PDF预览

SPC5746CHK1ACMJ6

更新时间: 2024-10-30 14:59:23
品牌 Logo 应用领域
恩智浦 - NXP PC
页数 文件大小 规格书
76页 992K
描述
Ultra-Reliable MPC574xB/C/G MCUs for Automotive and Industrial Control and Gateway

SPC5746CHK1ACMJ6 数据手册

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Document Number MPC5746C  
Rev. 6, 11/2018  
NXP Semiconductors  
Data Sheet: Technical Data  
MPC5746C  
MPC5746C Microcontroller  
Datasheet  
Features  
• 32-channel eDMA controller with multiple transfer  
request sources using DMAMUX  
• 1 × 160 MHz Power Architecture® e200z4 Dual issue,  
32-bit CPU  
• Boot Assist Flash (BAF) supports internal flash  
programming via a serial link (SCI)  
– Single precision floating point operations  
– 8 KB instruction cache and 4 KB data cache  
– Variable length encoding (VLE) for significant code  
density improvements  
• Analog  
– Two analog-to-digital converters (ADC), one 10-bit  
and one 12-bit  
• 1 x 80 MHz Power Architecture® e200z2 Single issue,  
32-bit CPU  
– Three analog comparators  
– Cross Trigger Unit to enable synchronization of  
ADC conversions with a timer event from the  
eMIOS or from the PIT  
– Using variable length encoding (VLE) for  
significant code size footprint reduction  
• End to end ECC  
• Communication  
– All bus masters, for example, cores, generate a  
single error correction, double error detection  
(SECDED) code for every bus transaction  
– SECDED covers 64-bit data and 29-bit address  
– Four Deserial Serial Peripheral Interface (DSPI)  
– Four Serial Peripheral interface (SPI)  
– 16 serial communication interface (LIN) modules  
– Eight enhanced FlexCAN3 with FD support  
– Four inter-IC communication interface (I2C)  
– ENET complex (10/100 Ethernet) that supports  
Multi queue with AVB support, 1588, and MII/  
RMII  
• Memory interfaces  
– 3 MB on-chip flash memory supported with the  
flash memory controller  
– 3 x flash memory page buffers (3-port flash memory  
controller)  
– Dual-channel FlexRay controller  
– 384 KB on-chip SRAM across three RAM ports  
• Audio  
– Synchronous Audio Interface (SAI)  
– Fractional clock dividers (FCD) operating in  
conjunction with the SAI  
• Clock interfaces  
– 8-40 MHz external crystal (FXOSC)  
– 16 MHz IRC (FIRC)  
– 128 KHz IRC (SIRC)  
• Configurable I/O domains supporting FlexCAN,  
LINFlexD, Ethernet, and general I/O  
– 32 KHz external crystal (SXOSC)  
– Clock Monitor Unit (CMU)  
– Frequency modulated phase-locked loop (FMPLL)  
– Real Time Counter (RTC)  
• Supports wake-up from low power modes via the  
WKPU controller  
• On-chip voltage regulator (VREG)  
• System Memory Protection Unit (SMPU) with up to 32  
region descriptors and 16-byte region granularity  
• Debug functionality  
– e200z2 core:NDI per IEEE-ISTO 5001-2008  
• 16 Semaphores to manage access to shared resources  
Class3+  
• Interrupt controller (INTC) capable of routing  
interrupts to any CPU  
– e200z4 core: NDI per IEEE-ISTO 5001-2008 Class  
3+  
• Crossbar switch architecture for concurrent access to  
peripherals, flash memory, and RAM from multiple  
bus masters  
NXP reserves the right to change the production detail specifications as may be  
required to permit improvements in the design of its products.  

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