是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | LEAD FREE, PLASTIC, MICRO, SOIC-8 | Reach Compliance Code: | unknown |
风险等级: | 5.66 | 其他特性: | RESET THRESHOLD VOLTAGE IS 2.63V; MANUAL RESET INPUT |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | S-PDSO-G8 | JESD-609代码: | e3 |
长度: | 2.9972 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | TSSOP | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 1.0922 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
温度等级: | COMMERCIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 2.8 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SP708REN | SIPEX |
获取价格 |
+3.0V/+3.3V Low Power Microprocessor Supervisory Circuits | |
SP708REN-L | SIPEX |
获取价格 |
暂无描述 | |
SP708REN-L | EXAR |
获取价格 |
3.0V/3.3V Low Power Microprocessor Supervisory Circuits | |
SP708REN-L/TR | EXAR |
获取价格 |
3.0V/3.3V Low Power Microprocessor Supervisory Circuits | |
SP708REP | SIPEX |
获取价格 |
+3.0V/+3.3V Low Power Microprocessor Supervisory Circuits | |
SP708REP | EXAR |
获取价格 |
Power Supply Support Circuit, Fixed, 1 Channel, PDIP8, PLASTIC, DIP-8 | |
SP708REP-L | SIPEX |
获取价格 |
Power Supply Support Circuit, Fixed, 1 Channel, PDIP8, LEAD FREE, PLASTIC, DIP-8 | |
SP708REU | SIPEX |
获取价格 |
+3.0V/+3.3V Low Power Microprocessor Supervisory Circuits | |
SP708REU | EXAR |
获取价格 |
Power Supply Support Circuit, Fixed, 1 Channel, PDSO8, PLASTIC, MICRO, SOIC-8 | |
SP708REU-L | SIPEX |
获取价格 |
Power Supply Support Circuit, Fixed, 1 Channel, PDSO8, LEAD FREE, PLASTIC, MICRO, SOIC-8 |