Intel® Core™ 2 Duo GME965 COM-Express
CPU Module
SOM-5786
NEW
Features
2 DDR2 SODIMM sockets (top and bottom)
. Embedded Intel® Core™ 2 Duo/Celeron® M processor
. Intel GME965/ICH8-M Chipsets
. Supports dual DDR2 SODIMM up to 4 GB
. Mobile Intel GMA X3100 3D/2D engine
. Display type: 2 x 24-bit LVDS/VGA/2 SDVO or PCIe x16
. Intel 10/100/1000 Mbps LAN
Intel Core
2 Duo
Processor
Intel ICH8-M
220-pin connector
(PCIe x16/PCI/IDE)
. Expansion: 5 PCIe x1, 4 PCI master, LPC
. 8 x USB 2.0, 3 SATAII, 1 EIDE, 8-bit GPIO
220-pin connector
(PCIe/VGA/AC97/
LPC/USB/LAN)
Intel GME965
Specifications
Form Factor
COM-Express, Module Pin-out Type II
Intel Core 2 Duo Processor
CPU
Front Side Bus
System Chipset
BIOS
533/800 MHz
Intel GME965 GMCH/ICH8-M
AWARD 4 Mbit Flash BIOS
Processor System
Technology
Max. Capacity
Socket
DDR2 533/667 MHz
up to 4 GB
2 x 200-pin SODIMM sockets
Intel GME965
Memory
Chipset
VRAM
Graphics Engine
LCD
DVMT 4.0 supports up to 384 MB
Mobile Intel GMA X3100 3D/2D engine
2 x 24-bit LVDS
Display
Ethernet
VGA
SDVO
Dual Display
Chipset
Speed
up to 2048 x 1536
2 SDVO Ports
CRT + LCD (Note: SDVO function is supported by customized BIOS)
Intel 82566MM Gigabit Ethernet
10/100/1000 Mbps
WatchDog Timer
Expansion
256 timer intervals, from 0 to 255 sec or min setup by software, jumperless selection, generates system reset
LPC, PCIe x16, 5 PCIe x1, 4 PCI master
1 x EIDE (UDMA 100)
PATA
SATA
3 x SATAII
I/O
USB
8 x USB 2.0
Audio
GPIO
High definition audio interface
8-bit GPIO
Power Type
Power Supply Voltage
ATX, AT
+12 V and +5 VSB for ATX, +12V for AT
Typical: (1 GB DDR2 667)
+12 V @ 1.22 A (Intel Core 2 Duo U7500)
+12 V @ 1.56 A (Intel Core 2 Duo T7500)
Max: (1 GB DDR2 667)
+12 V @ 1.64 A (Intel Core 2 Duo U7500)
+12 V @ 3.03 A (Intel Core 2 Duo T7500)
0 ~ 60° C (32 ~ 140° F)
0% ~ 90% relative humidity, non-condensing
125 x 95 mm (4.92" x 3.74")
Power Consumption
(Typical)
Power
Power Consumption
(Max, test in HCT)
Operating Temperature
Operating Humidity
Dimensions
Environment
Mechanical
Computer On Modules
All product specifications are subject to change without notice
Last updated : 24-Mar-2009