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SCLS233N − OCTOBER 1995 − REVISED MARCH 2005
D
D
Inputs Are TTL-Voltage Compatible
D
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
Latch-Up Performance Exceeds 250 mA Per
JESD 17
− 1000-V Charged-Device Model (C101)
SN54AHCT245 . . . J OR W PACKAGE
SN74AHCT245 . . . DB, DGV, DW, N, NS,
OR PW PACKAGE
SN74AHCT245 . . . RGY PACKAGE
(TOP VIEW)
SN54AHCT245 . . . FK PACKAGE
(TOP VIEW)
(TOP VIEW)
1
20
DIR
A1
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
CC
3
2
1 20 19
18
A3
A4
A5
A6
A7
B1
B2
4
5
6
7
8
19
18
17
16
15
14
13
12
2
3
4
5
6
7
8
9
A1
A2
A3
A4
A5
A6
A7
A8
OE
B1
B2
B3
B4
B5
B6
B7
OE
B1
B2
B3
B4
B5
B6
B7
B8
17
A2
16 B3
A3
15
B4
B5
A4
14
A5
9 10 11 12 13
A6
A7
A8
10
11
GND
description/ordering information
These octal bus transceivers are designed for asynchronous two-way communication between data buses. The
control-function implementation minimizes external timing requirements.
The ’AHCT245 devices allow data transmission from the A bus to the B bus or from the B bus to the A bus,
depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to
disable the device so that the buses effectively are isolated.
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup
CC
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube
SN74AHCT245N
SN74AHCT245N
QFN − RGY
Tape and reel
Tube
SN74AHCT245RGYR HB245
SN74AHCT245DW
SOIC − DW
AHCT245
Tape and reel
Tape and reel
Tape and reel
Tube
SN74AHCT245DWR
SN74AHCT245NSR
SN74AHCT245DBR
SN74AHCT245PW
SN74AHCT245PWR
SOP − NS
AHCT245
HB245
−40°C to 85°C
SSOP − DB
TSSOP − PW
HB245
Tape and reel
Tape and reel
Tube
TVSOP − DGV
CDIP − J
SN74AHCT245DGVR HB245
SNJ54AHCT245J
SNJ54AHCT245W
SNJ54AHCT245FK
SNJ54AHCT245J
CFP − W
Tube
SNJ54AHCT245W
SNJ54AHCT245FK
−55°C to 125°C
LCCC − FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2005, Texas Instruments Incorporated
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