SN54AHCT139, SN74AHCT139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS267M – DECEMBER 1995 – REVISED MARCH 2003
SN54AHCT139 . . . J OR W PACKAGE
SN74AHCT139 . . . D, DB, DGV, N, NS, OR PW PACKAGE
(TOP VIEW)
Inputs Are TTL-Voltage Compatible
Designed Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
1G
1A
V
CC
2G
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Incorporate Two Enable Inputs to Simplify
Cascading and/or Data Reception
1B
2A
1Y0
1Y1
1Y2
1Y3
GND
2B
Latch-Up Performance Exceeds 250 mA Per
JESD 17
2Y0
2Y1
2Y2
2Y3
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN54AHCT139 . . . FK PACKAGE
(TOP VIEW)
description/ordering information
The ’AHCT139 devices are dual 2-line to 4-line
decoders/demultiplexers designed for 4.5-V to
5.5-V
V
operation. These devices are
CC
3
2
1 20 19
18
2A
2B
1B
1Y0
NC
4
5
6
7
8
designed to be used in high-performance
memory-decoding or data-routing applications
requiring very short propagation delay times. In
high-performance memory systems, these
decoders can be used to minimize the effects of
system decoding. When used with high-speed
memories utilizing a fast enable circuit, the delay
timesofthesedecodersandtheenabletimeofthe
memory usually are less than the typical access
time of the memory. This means that the effective
system delay introduced by the decoders is
negligible.
17
16 NC
15
2Y0
2Y1
1Y1
1Y2
14
9 10 11 12 13
NC – No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP – N
SOIC – D
Tube
SN74AHCT139N
SN74AHCT139N
Tube
SN74AHCT139D
AHCT139
Tape and reel
Tape and reel
Tape and reel
Tube
SN74AHCT139DR
SN74AHCT139NSR
SN74AHCT139DBR
SN74AHCT139PW
SN74AHCT139PWR
SN74AHCT139DGVR
SNJ54AHCT139J
SNJ54AHCT139W
SNJ54AHCT13FK
SOP – NS
AHCT139
HB139
–40°C to 85°C
SSOP – DB
TSSOP – PW
HB139
Tape and reel
Tape and reel
Tube
TVSOP – DGV
CDIP – J
HB139
SNJ54AHCT139J
SNJ54AHCT139W
SNJ54AHCT139FK
–55°C to 125°C
CFP – W
Tube
LCCC – FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
1
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