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SCAS541E − OCTOBER 1995 − REVISED OCTOBER 2003
SN54AC574 . . . J OR W PACKAGE
SN74AC574 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
D
D
2-V to 6-V V
Operation
CC
Inputs Accept Voltages to 6 V
Max t of 8.5 ns at 5 V
pd
3-State Outputs Drive Bus Lines Directly
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE
1D
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3D
4D
5D
6D
7D
8D
V
CC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
CLK
description/ordering information
These 8-bit flip-flops feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. The devices
are particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
GND
The eight flip-flops of the ′AC574 devices are
D-type edge-triggered flip-flops. On the positive
transition of the clock (CLK) input, the Q outputs
are set to the logic levels set up at the data (D)
inputs.
SN54AC574 . . . FK PACKAGE
(TOP VIEW)
A buffered output-enable (OE) input can be used
to place the eight outputs in either a normal
logic state (high or low logic levels) or the
high-impedance state. In the high-impedance
state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and
the increased drive provide the capability to drive
bus lines in a bus-organized system without need
for interface or pullup components.
3
2
1
20 19
18
2Q
3Q
4Q
5Q
3D
4D
5D
6D
7D
4
5
6
7
8
17
16
15
14 6Q
9 10 11 12 13
OE does not affect internal operations of the
flip-flop. Old data can be retained or new data can
be entered while the outputs are in the
high-impedance state.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube
SN74AC574N
SN74AC574N
Tube
SN74AC574DW
SN74AC574DWR
SN74AC574NSR
SN74AC574DBR
SN74AC574PW
SN74AC574PWR
SNJ54AC574J
SOIC − DW
AC574
Tape and reel
Tape and reel
Tape and reel
Tube
SOP − NS
AC574
AC574
−40°C to 85°C
−55°C to 125°C
SSOP − DB
TSSOP − PW
AC574
Tape and reel
Tube
CDIP − J
CFP − W
LCCC − FK
SNJ54AC574J
SNJ54AC574W
SNJ54AC574FK
Tube
SNJ54AC574W
SNJ54AC574FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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1
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