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SCAS554D − NOVEMBER 1995 − REVISED OCTOBER 2003
SN54AC534 . . . J OR W PACKAGE
SN74AC534 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
D
D
2-V to 6-V V
Operation
CC
Inputs Accept Voltages to 6 V
Max t of 11 ns at 5 V
pd
3-State Inverting Outputs Drive Bus Lines
Directly
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
V
CC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
D
Full Parallel Access for Loading
description/ordering information
These octal edge-triggered D-type flip-flops
feature 3-state outputs designed specifically for
driving
highly
capacitive
or
relatively
low-impedance loads. The devices are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
GND
SN54AC534 . . . FK PACKAGE
(TOP VIEW)
On the positive transition of the clock (CLK) input,
the Q outputs are set to the complements of the
logic levels set up at the data (D) inputs.
3
2 1 20 19
18
8D
7D
7Q
6Q
6D
2D
2Q
3Q
3D
4D
4
5
6
7
8
A buffered output-enable (OE) input can be used
to place the eight outputs in either a normal logic
state (high or low logic levels) or the
high-impedance state. In the high-impedance
state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and
increased drive provide the capability to drive bus
lines without need for interface or pullup
components.
17
16
15
14
9 10 11 12 13
OE does not affect internal operations of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube
SN74AC534N
SN74AC534N
Tube
SN74AC534DW
SN74AC534DWR
SN74AC534NSR
SN74AC534DBR
SN74AC534PW
SN74AC534PWR
SNJ54AC534J
SOIC − DW
AC534
Tape and reel
Tape and reel
Tape and reel
Tube
SOP − NS
AC534
AC534
−40°C to 85°C
−55°C to 125°C
SSOP − DB
TSSOP − PW
AC534
Tape and reel
Tube
CDIP − J
CFP − W
LCCC − FK
SNJ54AC534J
SNJ54AC534W
SNJ54AC534FK
Tube
SNJ54AC534W
SNJ54AC534FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
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1
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