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SCAS513E − JUNE 1995 − REVISED OCTOBER 2003
SN54AC241 . . . J OR W PACKAGE
SN54AC241 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
D
2-V to 6-V V
Operation
CC
Inputs Accept Voltages to 6 V
Max t of 7.5 ns at 5 V
pd
1
2
3
4
5
6
7
8
9
10
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
20
19
18
17
16
15
14
13
12
11
V
CC
description/ordering information
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
These octal buffers and line drivers are designed
specifically to improve the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters.
The ’AC241 devices are organized as two 4-bit
buffers/drivers with separate complementary
output-enable (1OE and 2OE) inputs. When 1OE
is low or 2OE is high, the device passes
noninverted data from the A inputs to the
Y outputs. When 1OE is high or 2OE is low, the
outputs are in the high-impedance state.
SN54AC241 . . . FK PACKAGE
(TOP VIEW)
To ensure the high-impedance state during power
3
2
1
20 19
18
up or power down, OE should be tied to V
CC
1Y1
2A4
1Y2
1A2
2Y3
1A3
2Y2
1A4
4
5
6
7
8
through a pullup resistor and OE should be tied to
GND through a pulldown resistor; the minimum
value of the resistor is determined by the
current-sinking or the current-sourcing capability
of the driver.
17
16
15 2A3
14 1Y3
9 10 11 12 13
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube
SN74AC241N
SN74AC241N
Tube
SN74AC241DW
SN74AC241DWR
SN74AC241NSR
SN74AC241DBR
SN74AC241PW
SN74AC241PWR
SNJ54AC241J
SOIC − DW
AC241
Tape and reel
Tape and reel
Tape and reel
Tube
SOP − NS
AC241
AC241
−40°C to 85°C
SSOP − DB
TSSOP − PW
AC241
Tape and reel
Tube
CDIP − J
CFP − W
LCCC − FK
SNJ54AC241J
SNJ54AC241W
SNJ54AC241FK
Tube
SNJ54AC241W
SNJ54AC241FK
−55°C to 125°C
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
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