Preliminary
SNC739
16-bit Voice Processor
============ CONTENTS ============
1. INTRODUCTION..............................................................................................................................3
2. FEATURES.........................................................................................................................................3
3. PIN ASSIGNMENT ...........................................................................................................................4
4. ROM TABLE......................................................................................................................................6
5. RAM TABLE......................................................................................................................................7
6. SYSTEM CLOCK..............................................................................................................................8
6.1 CRYSTAL INPUT .................................................................................................................................8
6.2 ROSC INPUT ......................................................................................................................................8
7. I/O PORT ............................................................................................................................................9
8. TIMER/COUNTER .........................................................................................................................10
9. PUSH-PULL DAC............................................................................................................................11
10. REGULATOR ................................................................................................................................11
10. ABSOLUTE MAXIMUM RATINGS...........................................................................................12
11. ELECTRICAL CHARACTERISTICS........................................................................................12
12. APPLICATION CIRCUIT............................................................................................................13
13. BONDING PAD..............................................................................................................................15
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Ver. 1.6
March 7, 2007