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SN75976A1DL PDF预览

SN75976A1DL

更新时间: 2024-11-07 22:22:15
品牌 Logo 应用领域
德州仪器 - TI 线路驱动器或接收器驱动程序和接口接口集成电路光电二极管输入元件信息通信管理
页数 文件大小 规格书
28页 459K
描述
9-CHANNEL DIFFERENTIAL TRANSCEIVER

SN75976A1DL 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SSOP
包装说明:SSOP, SSOP56,.4针数:56
Reach Compliance Code:compliantECCN代码:5A991.B
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:1.19Is Samacsys:N
其他特性:COMMON I/O; ADDITIONAL COMMON ENABLE INPUT差分输出:YES
驱动器位数:9高电平输入电流最大值:0.0001 A
输入特性:DIFFERENTIAL SCHMITT TRIGGER接口集成电路类型:LINE TRANSCEIVER
接口标准:X3.129; X3.131; X3.277; EIA-485; SCSI-2; ISO 8482; IPIJESD-30 代码:R-PDSO-G56
JESD-609代码:e4长度:18.415 mm
湿度敏感等级:2功能数量:9
端子数量:56最高工作温度:70 °C
最低工作温度:最小输出摆幅:1 V
输出特性:3-STATE最大输出低电流:0.008 A
输出极性:COMPLEMENTARY封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装等效代码:SSOP56,.4
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:5 V
认证状态:Not Qualified最大接收延迟:16.5 ns
接收器位数:9座面最大高度:2.79 mm
子类别:Line Driver or Receivers最大压摆率:60 mA
最大供电电压:5.25 V最小供电电压:4.75 V
标称供电电压:5 V电源电压1-最大:5.25 V
电源电压1-分钟:4.75 V电源电压1-Nom:5 V
表面贴装:YES技术:BICMOS
温度等级:COMMERCIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
最大传输延迟:13.5 ns宽度:7.5 mm
Base Number Matches:1

SN75976A1DL 数据手册

 浏览型号SN75976A1DL的Datasheet PDF文件第2页浏览型号SN75976A1DL的Datasheet PDF文件第3页浏览型号SN75976A1DL的Datasheet PDF文件第4页浏览型号SN75976A1DL的Datasheet PDF文件第5页浏览型号SN75976A1DL的Datasheet PDF文件第6页浏览型号SN75976A1DL的Datasheet PDF文件第7页 
SN75976A, SN55976A  
9-CHANNEL DIFFERENTIAL TRANSCEIVER  
SLLS218B – MAY 1995 – REVISED MAY 1997  
SN75976A DGG or DL  
SN55976A WD  
(TOP VIEW)  
Improved Speed and Package Replacement  
for the SN75LBC976  
Designed to Operate at up to 20 Million  
Data Transfers per Second (Fast-20 SCSI)  
GND  
BSR  
CDE2  
CDE1  
CDE0  
9B+  
1
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
Nine Differential Channels for the Data and  
Control Paths of the Small Computer  
Systems Interface (SCSI) and Intelligent  
Peripheral Interface (IPI)  
2
CRE  
3
1A  
4
1DE/RE  
2A  
9B–  
5
SN75976A Packaged in Shrink  
8B+  
6
Small-Outline Package with 25-Mil Terminal  
Pitch (DL) and Thin Shrink Small-Outline  
Package with 20-Mil Terminal Pitch (DGG)  
2DE/RE  
3A  
8B–  
7
7B+  
8
3DE/RE  
4A  
7B–  
9
SN55976A Packaged in a 56-Pin Ceramic  
Flat Pack (WD)  
6B+  
10  
11  
12  
4DE/RE  
6B–  
V
V
Two Skew Limits Available  
CC  
CC  
GND 13  
GND 14  
44 GND  
43 GND  
ESD Protection on Bus Terminals  
Exceeds 12 kV  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
GND  
GND  
GND  
GND  
GND  
GND  
Low Disabled Supply Current 8 mA Typ  
Thermal Shutdown Protection  
Positive- and Negative-Current Limiting  
Power-Up/Down Glitch Protection  
V
V
CC  
5A  
CC  
5B+  
5B–  
4B+  
4B–  
3B+  
3B–  
2B+  
2B–  
1B+  
1B–  
5DE/RE  
6A  
description  
6DE/RE  
7A  
The SN75976A is an improved replacement for  
the industry’s first 9-channel RS-485  
7DE/RE  
8A  
transceiver — the SN75LBC976. The A version  
offers improved switching performance, a smaller  
package, and higher ESD protection. The  
SN75976A is offered in two versions. The ’976A2  
skew limits of 4 ns for the differential drivers and  
5 ns for the differential receivers complies with the  
recommended skew budget of the Fast-20 SCSI  
standard for data transfer rates up to 20 million  
transfers per second. The ’976A1 supports the  
Fast SCSI skew budget for 10 million  
8DE/RE  
9A  
9DE/RE  
Terminals 13 through 17 and 40 through 44 are  
connected together to the package lead frame  
and signal ground.  
transferspersecond. Theskewlimitensuresthatthepropagationdelaytimes, notonlyfromchannel-to-channel  
but from device-to-device, are closely matched for the tight skew budgets associated with high-speed parallel  
data buses.  
The patented thermal enhancements made to the 56-pin shrink small-outline package (SSOP) of the SN75976  
have been applied to the new, thin shrink, small-outline package (TSSOP). The TSSOP package offers even  
less board area requirements than the SSOP while reducing the package height to 1 mm. This provides more  
board area and allows component mounting to both sides of the printed circuit boards for low-profile,  
space-restricted applications such as small form-factor hard disk drives.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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