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ꢈ ꢌ ꢍꢎꢏ ꢐ ꢏꢇ ꢇꢇ ꢈ ꢊ ꢋ ꢃ ꢐ ꢑꢒꢁꢀ ꢄꢒꢐ ꢏꢓ ꢁ ꢐ ꢑꢒꢁꢀ ꢆꢇ ꢏ ꢅꢇ ꢑ
ꢔ ꢏꢐ ꢕ ꢇꢑ ꢑꢓꢑ ꢍꢖꢑ ꢇꢇ ꢗ ꢓ ꢔꢇ ꢑ ꢘ ꢗ
SCES541 − JANUARY 2004
DGG OR DL PACKAGE
(TOP VIEW)
D
D
D
Auto-Power-Up Feature Prevents Printer
Errors When Printer Is Turned On, But No
Valid Signal Is at A9−A13 Pins
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
HD
A9
DIR
Y9
1.4-kΩ Pullup Resistors Integrated on All
Open-Drain Outputs Eliminate the Need for
Discrete Resistors
2
3
A10
A11
A12
A13
Y10
Y11
Y12
Y13
4
Designed for the IEEE Std 1284-I (Level-1
Type) and IEEE Std 1284-II (Level-2 Type)
Electrical Specifications
5
6
7
V
V
CABLE
CC
A1
CC
D
D
D
D
Flow-Through Architecture Optimizes PCB
Layout
8
B1
9
A2
GND
A3
A4
A5
A6
GND
A7
B2
GND
B3
B4
B5
B6
GND
B7
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
I
and Power-Up 3-State Support Hot
off
Insertion
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection
−
−
4 kV − Human-Body Model
8 kV − IEC 61000-4-2, Contact Discharge
(Connector Pins)
A8
B8
V
V
CABLE
CC
CC
−
−
15 kV − IEC 61000-4-2, Air-Gap
Discharge (Connector Pins)
15 kV − Human-Body Model (Connector
Pins)
PERI LOGIC IN
PERI LOGIC OUT
C14
C15
C16
A14
A15
A16
A17
C17
description/ordering information
HOST LOGIC OUT
HOST LOGIC IN
The SN74LVCE161284 is designed for 3-V to
3.6-V V
operation. This device provides
CC
asynchronous two-way communication between
data buses. The control-function implementation
minimizes external timing requirements.
This device has eight bidirectional bits; data can flow in the A-to-B direction when the direction-control
input (DIR) is high and in the B-to-A direction when DIR is low. This device also has five drivers that drive the
cable side, and four receivers. The SN74LVCE161284 has one receiver dedicated to the HOST LOGIC line and
a driver to drive the PERI LOGIC line.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
Tube
SN74LVCE161284DL
SSOP − DL
LVCE161284
0°C to 70°C
Tape and reel SN74LVCE161284DLR
TSSOP − DGG
Tape and reel SN74LVCE161284DGGR LVCE161284
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
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